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公开(公告)号:US20200243703A1
公开(公告)日:2020-07-30
申请号:US16652776
申请日:2018-10-08
Applicant: DSM IP Assets B.V.
IPC: H01L31/049 , B32B15/20 , B32B27/36 , B32B27/20 , B32B27/08
Abstract: The present invention relates to an electro-conductive back-sheet for back-contact photovoltaic cell technologies comprising an aluminum layer, a cold sprayed metal layer on top of the aluminum layer and a polymeric back-sheet having an (OTR) of at least 20 cm3/m2·atm per day. The metal used for the metal layer is chosen from the group consisting of copper, tin, silver or nickel, or mixtures of two or more thereof or alloys of two or more thereof. Preferably the metal is copper. The metal layer preferably has a thickness in the range of 50 nm-10 μm. The present invention further relates to process for the manufacturing of the electro-conductive back-sheet. The present invention also relates to a photovoltaic module comprising the electro-conductive back-sheet.