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公开(公告)号：US12091507B2
公开(公告)日：2024-09-17
申请号：US17042493
申请日：2019-04-01
发明人： Michael Henry Howard, Jr. , Nora Sabina Radu , Greg A. Hostetler , Chai Kit Ngai , Brian C. Auman , John Donald Summers
IPC分类号： C08G73/10 , C08J5/18 , C09D179/08 , G02F1/1333
CPC分类号： C08G73/1042 , C08G73/1085 , C08J5/18 , C09D179/08 , G02F1/133305 , C08J2379/08 , C09K2323/06
摘要： Disclosed is a polyimide having a repeat unit structure of Formula III
In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II
In Formula II: R1 is H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R2 is halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R3 and R4 are the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.-
公开(公告)号：US20240317940A1
公开(公告)日：2024-09-26
申请号：US18187072
申请日：2023-03-21
发明人： Nora Sabina Radu , Jaclyn Murphy , Chai Kit Ngai , Greg A. Hostetler , Qing Min Wang , Tao Huang , Anton Li , Tanya N. Singh-Rachford
CPC分类号： C08G73/1042 , C08G73/1017 , C08G73/1032 , C08G73/1039 , C08G73/1071 , C08G73/127 , C08J5/18 , C09D7/47 , C09D7/63 , C09D179/085 , H05K1/0346 , H05K3/18 , C08J2379/08 , H05K2201/0154
摘要： There is provided a soluble polyimide resin comprising: (a) one or more tetracarboxylic acid component residues: (b) one or more diamine component residues; and (c) one or more endcapping compounds; wherein: the one or more endcapping compounds comprise one or more crosslinking groups. The soluble polyimide resin can be used in electronics applications.
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