公开(公告)号：US20190169733A1

公开(公告)日：2019-06-06

申请号：US16267798

申请日：2019-02-05

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Chikao IKENAGA ,  Yo SHIMAZAKI ,  Kentarou SEKI ,  Hiroki FURUSHOU ,  Chiaki HATSUTA

IPC: C23C14/04 ,  G03F7/00 ,  C23F1/02 ,  C25D1/08 ,  H01L51/50 ,  H05B33/10

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

公开(公告)号：US20180334740A1

公开(公告)日：2018-11-22

申请号：US15763595

申请日：2016-09-29

Applicant: Dai Nippon Printing co., Ltd.

Inventor： Chikao IKENAGA ,  Yo SHIMAZAKI ,  Kentarou SEKI ,  Hiroki FURUSHOU ,  Chiaki HATSUTA

IPC: C23C14/04 ,  C25D1/08

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).