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公开(公告)号：US20230062683A1
公开(公告)日：2023-03-02
申请号：US17996805
申请日：2021-04-28
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Seiji TAKE , Shuji KAWAGUCHI , Chiaki HATSUTA
Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.
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公开(公告)号：US20210214843A1
公开(公告)日：2021-07-15
申请号：US17121916
申请日：2020-12-15
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Yasuko SONE , Hiroshi KAWASAKI , Yoshinori HIROBE , Katsunari OBATA , Asako NARITA , Hitoshi ISHIRO , Chiaki HATSUTA
Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 μm.
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公开(公告)号：US20250043399A1
公开(公告)日：2025-02-06
申请号：US18918239
申请日：2024-10-17
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Hiroki OKA , Sachiyo MATSUURA , Chiaki HATSUTA , Chikao IKENAGA , Hideyuki OKAMOTO , Masato USHIKUSA
IPC: C22C38/10 , B21B1/22 , C21D6/00 , C21D8/02 , C21D9/46 , C22C38/08 , C23C2/26 , C23C14/04 , C23C14/24 , C25D1/04 , C25D3/56 , G03F7/00 , G03F7/20 , H10K50/11 , H10K59/00 , H10K71/00 , H10K71/16 , H10K77/10
Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 μm. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 μm2 to 50 μm2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
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公开(公告)号：US20230253708A1
公开(公告)日：2023-08-10
申请号：US17995599
申请日：2021-04-09
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Seiji TAKE , Shuji KAWAGUCHI , Chiaki HATSUTA
CPC classification number: H01Q9/0407 , H01Q21/28 , H01Q21/0093
Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.
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公开(公告)号：US20210157232A1
公开(公告)日：2021-05-27
申请号：US17168496
申请日：2021-02-05
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Chikao IKENAGA , Chiaki HATSUTA , Hiroki OKA , Sachiyo MATSUURA , Hideyuki OKAMOTO , Masato USHIKUSA
Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 μm. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 μm2 to 50 μm2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
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Patent Agency Ranking
公开(公告)号：US20240404928A1
公开(公告)日：2024-12-05
申请号：US18678270
申请日：2024-05-30
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Masahiro NAGATA , Kazuhiro SHINOZAKI , Masahiro YAMADA , Daisuke OKUYAMA , Chiaki HATSUTA , Kentarou SEKI , Hideto MATSUI , Kazunori OOUCHI
IPC: H01L23/495 , C23C18/22 , H01L21/48 , H01L23/00 , H01L23/31
Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
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公开(公告)号：US20210108312A1
公开(公告)日：2021-04-15
申请号：US17070127
申请日：2020-10-14
Applicant: Dai Nippon Printing Co., Ltd.
Inventor： Hiroki OKA , Chikao IKENAGA , Sachiyo MATSUURA , Shogo ENDO , Chiaki HATSUTA , Asako NARITA
IPC: C23C16/458 , H01L51/56
Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 μm or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 μm or more is 50 or less per 1 mm3 in the sample.
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公开(公告)号：US20180334740A1
公开(公告)日：2018-11-22
申请号：US15763595
申请日：2016-09-29
Applicant: Dai Nippon Printing co., Ltd.
Inventor： Chikao IKENAGA , Yo SHIMAZAKI , Kentarou SEKI , Hiroki FURUSHOU , Chiaki HATSUTA
Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
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公开(公告)号：US20250016928A1
公开(公告)日：2025-01-09
申请号：US18889578
申请日：2024-09-19
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Seiji TAKE , Shuji KAWAGUCHI , Chiaki HATSUTA
Abstract: A wiring board includes a substrate and a mesh wiring layer disposed on the substrate and including a plurality of wiring lines. The substrate has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.
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公开(公告)号：US20240145356A1
公开(公告)日：2024-05-02
申请号：US18279608
申请日：2022-09-01
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Masahiro NAGATA , Kazuhiro SHINOZAKI , Masahiro YAMADA , Daisuke OKUYAMA , Chiaki HATSUTA , Kentarou SEKI , Hideto MATSUI , Kazunori OOUCHI
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L23/49582 , H01L21/4842 , H01L23/49513 , H01L24/48 , H01L2224/48245
Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
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