Mask-Pattern Determination Using Topology Types
    1.
    发明申请
    Mask-Pattern Determination Using Topology Types 有权
    使用拓扑类型进行掩模图案确定

    公开(公告)号:US20070186208A1

    公开(公告)日:2007-08-09

    申请号:US11538420

    申请日:2006-10-03

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36 G03F1/68

    摘要: A method for determining a mask pattern is described. During the method, a first mask pattern that includes a plurality of second regions corresponding to the first regions of the photo-mask is provided. Then, a second mask pattern is determined based on the first mask pattern and differences between a target pattern and an estimate of a wafer pattern that results from the photolithographic process that uses at least a portion of the first mask pattern. Note that the determining includes different treatment for different types of regions in the target pattern, and the second mask pattern and the target pattern include pixilated images.

    摘要翻译: 描述用于确定掩模图案的方法。 在该方法期间,提供了包括对应于光掩模的第一区域的多个第二区域的第一掩模图案。 然后,基于第一掩模图案确定第二掩模图案,并且使用由使用至少一部分第一掩模图案的光刻处理得到的目标图案与晶片图案的估计之间的差。 注意,确定包括对目标图案中的不同类型的区域的不同处理,并且第二掩模图案和目标图案包括像素化图像。

    Lithography Verification Using Guard Bands
    2.
    发明申请
    Lithography Verification Using Guard Bands 有权
    使用防护带进行平版印刷验证

    公开(公告)号:US20070184369A1

    公开(公告)日:2007-08-09

    申请号:US11538290

    申请日:2006-10-03

    CPC分类号: G06F17/5081 G03F1/36

    摘要: A method for verifying a lithographic process is described. During the method, a set of guard bands are defined around a target pattern that is to be printed on a semiconductor die using a photo-mask in the lithographic process. An estimated pattern is calculated using a model of the lithographic process. This model of the lithographic process includes a mask pattern corresponding to the photo-mask and a model of an optical path. Then, whether or not positions of differences between the estimated pattern and the target pattern exceeded one or more guard bands in the set of guard bands is determined.

    摘要翻译: 描述了一种用于验证光刻工艺的方法。 在该方法期间,在平版印刷工艺中使用光掩模将待印刷在半导体管芯上的目标图案周围定义一组保护带。 使用光刻工艺的模型计算估计图案。 该光刻工艺的模型包括对应于光掩模的掩模图案和光路的模型。 然后,确定估计图案和目标图案之间的差异位置是否超过该组保护频带中的一个或多个保护频带。