公开(公告)号：US06421253B1

公开(公告)日：2002-07-16

申请号：US09658398

申请日：2000-09-08

Applicant: Daniel Ray Ash, Jr.

Inventor： Daniel Ray Ash, Jr.

IPC: H05K704

CPC classification number: H05K1/021 ,  H05K1/0237 ,  H05K1/142 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/0191 ,  H05K2203/0405 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A delamination resistant electronics module assembly includes a printed circuit board layer coupled to a pallet via a cured epoxy preform. The preform may include conductive epoxy, or non-conductive epoxy with conductive traces. Component wells are collectively formed by the preform and PCB layer for placement of heat generating components, such as RF components. Methods of manufacturing module assemblies include curing the epoxy preform by applying a predetermined elevated pressure and heat to a sub-assembly of the pallet, preform layer, and PCB layer.

Abstract translation: 防分离电子模块组件包括通过固化环氧树脂预成型件连接到托盘的印刷电路板层。 预成型件可以包括导电环氧树脂或具有导电迹线的非导电环氧树脂。 组分井由预成型件和PCB层共同形成，用于放置诸如RF部件的发热部件。 制造模块组件的方法包括通过对托盘，预成型件层和PCB层的子组件施加预定的升高的压力和加热来固化环氧树脂预制件。