摘要:
An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation along an optical axis towards the semiconductor element. The housed semiconductor element and the lens unit are embodied as two components. At least one spacer element is disposed outside the optical axis, between the housing of the semiconductor element and the lens unit. Due to the addition of a low-cost spacer element, the invention enables the simple compensation of possible remaining work tolerances, for example between client-specific semiconductor housings and lens units selected from lines of products of different production quality. While tolerance-exceeding lines of products have not had any use until now as rejects, reliable camera modules can advantageously be assembled using a compensation element according to the invention, and in principle, any mechanical adjustment of the focal point can also be dispensed with. Such camera modules can be suitable utilized inside a motor vehicle or outside of the same.
摘要:
An optical module has a circuit carrier, a housed semiconductor element placed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit, which is constructed separate from the cased semiconductor element, preferably comprises a lens assembly formed of, for example, three lenses and of a diaphragm. The three lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. According to the invention, a support is formed, at least in sections, on the case of the semiconductor element, and the lens unit is placed thereon thus being supported. The concept is that by forming a support directly on the case of a cased semiconductor element even with classically cased semiconductor chips, it is possible to construct a camera module with which every mechanical focus setting can be eliminated. The novel system is particularly suited for use in the interior or exterior of a motor vehicle.
摘要:
An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit preferably includes a lens assembly with, say, three lenses and a diaphragm. The lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. The lenses are held in a type of lens holder that is an integral component of the housing of the semiconductor element.
摘要:
An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit preferably includes a lens assembly with, say, three lenses and a diaphragm. The lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. The lenses are held in a type of lens holder that is an integral component of the housing of the semiconductor element.
摘要:
An optical module has a circuit carrier, a housed semiconductor element placed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit, which is constructed separate from the cased semiconductor element, preferably comprises a lens assembly formed of, for example, three lenses and of a diaphragm. The three lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. According to the invention, a support is formed, at least in sections, on the case of the semiconductor element, and the lens unit is placed thereon thus being supported. The concept is that by forming a support directly on the case of a cased semiconductor element even with classically cased semiconductor chips, it is possible to construct a camera module with which every mechanical focus setting can be eliminated. The novel system is particularly suited for use in the interior or exterior of a motor vehicle.