公开(公告)号：US5643000A

公开(公告)日：1997-07-01

申请号：US691859

申请日：1996-07-31

Applicant: Dave Dent

Inventor： Dave Dent

IPC: H05K1/18 ,  H05K7/10 ,  H05K7/14 ,  H01R9/09

CPC classification number: H05K7/1438 ,  H05K1/18 ,  H05K7/1084 ,  H05K2201/09954 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  Y10T29/49144

Abstract: Certain critical dimensions of an original microprocessor package, an upgrade socket, and an upgrade microprocessor package are made complementary to one another, enabling the upgrade socket to be wave soldered onto an area of the motherboard that encircles the area on which the original microprocessor package is surface mounted, and the upgrade microprocessor package remains capable of mating with the upgrade socket. In an alternate embodiment, in addition to having the various critical dimensions of the original microprocessor package, the upgrade socket and the upgrade microprocessor package coordinated with one another, the bottom portion of the upgrade socket is modified to have a smaller center out than the top portion of the upgrade socket, allowing a step to be exposed around the perimeter of the center cut out, and the original microprocessor package to be first solder mounted onto the new step, before the entire original microprocessor package and upgrade socket combination is wave soldered onto the motherboard.

Abstract translation: 原始微处理器封装，升级插座和升级微处理器封装的某些关键尺寸彼此互补，使升级插座能够波形焊接到主板上的环绕原始微处理器封装区域的区域 表面安装，升级微处​​理器包仍然能够与升级插座配合。 在替代实施例中，除了具有原始微处理器封装的各种关键尺寸之外，升级插座和升级微处理器封装彼此协调，升级插座的底部被修改为具有比顶部更小的中心 升级插座的一部分，允许在中心周边暴露出一步，将原始微处理器封装首先焊接到新步骤上，之后将整个原始微处理器封装和升级插座组合波形焊接到 主板。