Abstract:
A soldering device for soldering lead wires from a disc head to a circuit of the disc drive includes a heat shield adapted to provide a protective barrier for a soldering tip during operation of a soldering instrument. During operation, the soldering tip is heated by a heating element for use. A heat shield is coupled with the soldering tip and designed to provide a temperature barrier along the length of the soldering tip and prevent damage to other wires in close proximity.
Abstract:
A contained instrument cleaner including a housing having an enclosed chamber and an opening sized to insert an instrument. A rigid member having an abrading surface is supported inside the chamber for cleaning debris from an instrument. The device includes a vacuum channel opened to the chamber and coupleable to a vacuum source for removing debris. A method for cleaning an instrument including the steps of inserting an instrument into an enclosed chamber and rubbing the instrument against an abrading member in the enclosed chamber for removing debris. A vacuum is supplied in the enclosed chamber for collecting debris.
Abstract:
A soldering device includes an elongated hot bar and a plurality of spaced soldering tips supported along the hot bar for soldering multiple connections. A method of using the soldering device is also described.
Abstract:
A soldering member includes an elongated heating element for soldering a series of connectors. The elongated heating element of the soldering member is flexibly supported via a rigid base for adjusting the orientation of the heating element to align with a series of connectors rigidly supported for soldering. A method of using the soldering member is also described.