公开(公告)号：US6093904A

公开(公告)日：2000-07-25

申请号：US115759

申请日：1998-07-15

Applicant: Hiroshi Haji

Inventor： Hiroshi Haji

IPC: B23K1/20 ,  B23K20/00 ,  H05K13/00 ,  B23K10/00

CPC classification number: H01L24/85 ,  B23K1/20 ,  B23K20/004 ,  H01L24/78 ,  H05K13/0061 ,  B23K2201/36 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/7865 ,  H01L2224/85013 ,  H01L2224/85444 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041

Abstract: There are disclosed a surface treatment apparatus and a wire bonding apparatus which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost The surface treatment apparatus includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract translation: 公开了一种表面处理装置和引线接合装置，其尺寸紧凑，加工能力强，结构简单，成本低廉。表面处理装置包括具有用于传送物体的传送路径的基座， 设置在基座上方的盖，用于移动进入和离开与基座的上表面接触，盖接触基座，以在基座的上表面上形成密封空间;接合和分离机构，用于将盖移动到 与所述底座接触不良的传送机构，用于当所述盖与所述基座不接触时，将设置在所述传送路径上的所述物体送入和移出所述盖子下方的位置的传送机构，以及用于表面处理电极的处理部 设置在密封空间中的物体引线接合机构设置在传送路径的下游部分。

公开(公告)号：US06079609A

公开(公告)日：2000-06-27

申请号：US181193

申请日：1998-10-28

Applicant: James P. Fochtman

Inventor： James P. Fochtman

IPC: B23K20/12 ,  F01L9/04 ,  F16K31/06 ,  H01F7/08 ,  H01F7/16 ,  B23K20/227

CPC classification number: B23K20/129 ,  F01L9/04 ,  H01F7/081 ,  B23K2201/36

Abstract: A method of joining a magnetic armature of an electromagnetic actuator to a shaft is provided. The method includes holding the armature stationary while spinning the shaft. The spinning shaft is then pressing against the stationary armature such that friction between the shaft and the armature causes a portion of the armature and a portion of the shaft to melt and define a weld joint. The weld joint is permitted to cool thereby joining the shaft to the armature.

Abstract translation: 提供了将电磁致动器的磁性衔铁连接到轴的方法。 该方法包括在旋转轴的同时固定电枢。 旋转轴然后压靠固定电枢，使得轴和电枢之间的摩擦使电枢的一部分和轴的一部分熔化并限定焊接接头。 允许焊接接头冷却，从而将轴接合到电枢。

公开(公告)号：US6070780A

公开(公告)日：2000-06-06

申请号：US1183

申请日：1997-12-30

Applicant: Masayuki Shimura ,  Hisashi Arai ,  Masaki Okawara

Inventor： Masayuki Shimura ,  Hisashi Arai ,  Masaki Okawara

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/50 ,  H01L21/52 ,  B23K37/00 ,  B23K1/00 ,  B23K15/00 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/36 ,  H01L2224/48247 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082

Abstract: A bonding device equipped with a heating block for heating, for instance, a lead frame upon which bonding is performed including vacuum suction nozzles, which are installed above the heating block so as to lift the lead frame, and an air-cylinder, which raises and lowers the vacuum suction nozzles. The lead frame is lifted from the heating block by the vacuum suction nozzles, thus being prevented from being overly heated by the heating block.

Abstract translation: 一种装配有用于加热的加热块的接合装置，例如，其上进行结合的引线框架，包括真空吸嘴，其安装在加热块上方以提升引线框架;以及气缸，其升高 并降低真空吸嘴。 引线框架通过真空吸嘴从加热块提升，从而防止加热块过度加热。

公开(公告)号：US6043876A

公开(公告)日：2000-03-28

申请号：US168638

申请日：1998-10-08

Applicant: Albert Holliday ,  Ralph E. Stenerson, Jr.

Inventor： Albert Holliday ,  Ralph E. Stenerson, Jr.

IPC: B23K3/08 ,  G01R31/04 ,  G01R31/309 ,  H01L21/66 ,  H05K13/08 ,  G01B11/14

CPC classification number: H05K13/08 ,  B23K3/08 ,  B23K2201/36 ,  G01R31/048 ,  G01R31/309 ,  H01L22/12

Abstract: An apparatus is used to inspect an assembled circuit board having a device assembled to the circuit board by a ball grid array (BGA). The BGA includes a plurality of rows of solder connections. The apparatus has a source of light, which may be a laser. A first deflector is positioned to direct the light into a first side of the BGA, between two adjacent rows of solder connections in the BGA. A second deflector directs any light emitted from a second side of the BGA opposite the first side onto a target. The deflectors may be prisms, mirrors, or optical fibers. The target may be a viewing surface (such as a wall or screen) or a light detector, such as a camera, frame grabber, or photoelectric device. The absence of light on the target while the light is directed into the first side of the BGA indicates the presence of a solder bridge in the BGA. The light source, deflectors and detector may be moved at a constant rate along the length of the BGA, to provide a pattern of alternating light and dark illumination levels. The presence of a solder bridge may be detected based on the pattern.

Abstract translation: 一种装置用于检查具有通过球栅阵列（BGA）组装到电路板的装置的组装电路板。 BGA包括多排焊料连接。 该装置具有可以是激光的光源。 定位第一偏转器以将光引导到BGA的第一侧，在BGA中的两相邻的焊料连接行之间。 第二偏转器将从第一侧相反的BGA的第二侧发射的任何光引导到目标上。 偏转器可以是棱镜，反射镜或光纤。 目标可以是观察表面（例如墙壁或屏幕）或光检测器，例如相机，框架抓取器或光电装置。 当光被引导到BGA的第一侧时，靶上的光不存在指示在BGA中存在焊接桥。 光源，偏转器和检测器可以沿着BGA的长度以恒定速率移动，以提供交替的光和暗照明级别的图案。 可以基于图案检测焊接桥的存在。

公开(公告)号：US5938106A

公开(公告)日：1999-08-17

申请号：US691275

申请日：1996-08-01

Applicant: Mark Vincent Pierson

Inventor： Mark Vincent Pierson

IPC: B23K3/06 ,  H05K1/00 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  B23K3/00

CPC classification number: H05K3/3484 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/1225 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/42 ,  H05K1/0393 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/1545 ,  H05K3/0097 ,  H05K3/1216

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

公开(公告)号：US5789068A

公开(公告)日：1998-08-04

申请号：US498247

申请日：1995-06-29

Applicant: Charles E. King ,  Angelo J. Gulino

Inventor： Charles E. King ,  Angelo J. Gulino

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/365 ,  H05K1/02 ,  H05K3/34 ,  B32B7/02

CPC classification number: H05K3/3436 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2201/36 ,  B23K35/365 ,  H05K1/0269 ,  H05K2201/0179 ,  H05K2203/041 ,  H05K2203/161 ,  Y02P70/613 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/2998 ,  Y10T428/31

Abstract: The invention provides a solder preform coated with a predetermined thickness of parylene which physically and chemically protects the preform, as well as a provides a unique optical interference coating which reflects at characteristic frequencies. When predetermined thicknesses of parylene are selected, the parylene coating provides an interference coating which causes the solder preforms to appear green, or gold, or blue in color. The parylene coating, which is otherwise colorless and transparent thus enables solder preforms to be visually distinguishable by alloy type (or customer) by the use of colors, or blends of colors. The invention further provides an effective method of visually verifying the reflow status of a solder preform during manufacturing by examining the color of the solder preform after heating. The interference colors provided by the parylene coating do not persist through the reflow process, and thus, the change in color of the solder preform after reflow can be used as an effective visual check to determine if the preform has been heated sufficiently.

Abstract translation: 本发明提供涂覆有预定厚度的聚对二甲苯的焊料预制件，其物理和化学保护预成型件，以及提供以特征频率反射的独特的光学干涉涂层。 当选择聚对二甲苯的预定厚度时，聚对二甲苯涂层提供干涉涂层，其使得焊料预成型件呈现绿色，或金色或蓝色。 聚对二甲苯涂层，否则是无色透明的，因此可以通过使用颜色或颜色混合物，通过合金类型（或客户）在视觉上区分焊料预成型件。 本发明还提供了一种通过在加热后检查焊料预制件的颜色来在制造期间目视验证焊料预制件的回流状态的有效方法。 由聚对二甲苯涂层提供的干涉色不会通过回流工艺持续，因此，可以将回流焊后的焊料预制件的颜色变化用作有效的目视检查，以确定预成型件是否已被充分加热。

公开(公告)号：US5725143A

公开(公告)日：1998-03-10

申请号：US659042

申请日：1996-06-03

Applicant: Marc Leturmy

Inventor： Marc Leturmy

IPC: B23K3/06 ,  B23K1/08 ,  B23K31/02 ,  C23C2/08 ,  H05K3/34 ,  B23K1/00 ,  B23K3/00

CPC classification number: B23K1/085 ,  B23K2201/36 ,  B23K2201/42

Abstract: Wave soldering or tinning machine comprising: a solder reservoir; a means that forms at least one solder wave having a laminar form and including a flat surface; a means for bringing a piece to be soldered or tinned into contact with the laminar wave; and means for injection of a gas in the vicinity of the wave comprising an injector located in a position adjacent to and downstream from the wave and provided with a wall facing the solder wave, wherein the wall has at least a first group of openings positioned so as to produce a first gas jet directed toward the flat surface of the solder wave.

Abstract translation: 波峰焊或镀锡机包括：焊料槽; 形成至少一层具有层状且包括平坦表面的焊波的装置; 将一块焊接或镀锡与片状波接触的方法; 以及用于在波附近注入气体的装置，该气体包括位于与波浪相邻并且在其下游的位置的喷射器，并且设置有面向焊波的壁，其中所述壁具有至少第一组开口， 以产生朝向焊波的平坦表面的第一气体射流。

公开(公告)号：US5655704A

公开(公告)日：1997-08-12

申请号：US520284

申请日：1995-08-28

Applicant: Shoji Sakemi ,  Teruaki Nishinaka

Inventor： Shoji Sakemi ,  Teruaki Nishinaka

IPC: B23K3/06 ,  H05K3/34 ,  B23K1/20

CPC classification number: H01L24/742 ,  B23K3/0623 ,  H05K3/3478 ,  B23K2201/36 ,  H01L2224/11334 ,  H01L2924/01005 ,  H01L2924/01033 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557

Abstract: A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.

Abstract translation: 焊球安装装置包括用于将工件2定位在预定位置的工件定位机构“A”。 工件2具有形成有安装有焊锡球3的多个电极2a的上表面。 具有与电极2a对应的多个通孔4a的模板4以一对一的关系被支撑，使得它们的通孔4a位于工件2的相应电极2a正上方。 焊接球容器12设置在模板4上，用于在其中容纳焊球3。 焊球容器12具有开口底部，允许焊球3经由通孔4a落在模板4的下方。 一对X和Y电动机沿着沿水平方向设置的模板4的上表面移动焊球容器12。

公开(公告)号：US5631806A

公开(公告)日：1997-05-20

申请号：US509378

申请日：1995-07-31

Applicant: Robert Fried ,  Kuo J. Tseng ,  Hsi Y. Hsiao

Inventor： Robert Fried ,  Kuo J. Tseng ,  Hsi Y. Hsiao

IPC: B23K1/00 ,  H01L23/498 ,  H01L25/07 ,  H01R4/02 ,  H05K3/34 ,  H01L23/488 ,  B23K35/14

CPC classification number: B23K1/0016 ,  H01L23/49811 ,  H01L25/071 ,  H01R4/02 ,  H05K3/3426 ,  B23K2201/36 ,  H01L2924/0002 ,  Y02P70/613

Abstract: The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.

Abstract translation: 焊接在电路模块中的电气部件之间的引线的部分包括一个或多个径向延伸的狭缝。 一旦加热，流体焊料通过毛细管作用被吸入狭缝。 被困空气逸出，消除气袋或缝隙。 结果是更强的接头和焊料溢出的减少。

公开(公告)号：US5591941A

公开(公告)日：1997-01-07

申请号：US144981

申请日：1993-10-28

Applicant: John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

Inventor： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

IPC: B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H06K1/14

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

Abstract translation: 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。