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    Power semiconductor module
    3.
    发明授权
    Power semiconductor module 有权
    功率半导体模块

    公开(公告)号：US6078501A

    公开(公告)日：2000-06-20

    申请号：US215580

    申请日：1998-12-17

    申请人： John Catrambone ,  David Doiron ,  Jay Greenspan ,  William Driscoll ,  Christopher Clarke ,  Boris Semenov

    发明人： John Catrambone ,  David Doiron ,  Jay Greenspan ,  William Driscoll ,  Christopher Clarke ,  Boris Semenov

    IPC分类号： H01L25/07 ,  H01L25/18 ,  H02M7/00 ,  H05K7/20

    CPC分类号： H02M7/003 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49111

    摘要： An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself. The adapter plate may also contain active and/or passive circuitry.

    摘要翻译： 公开了一种用于提供高可靠性和高性能操作的电子模块或封装。 该封装包括具有金属底板和陶瓷盖的气密密封外壳，并且其中包含一个或多个电路或设备，其通常是功率整流器，电桥或功率控制电路。 一个或多个电源端子设置在顺应地支撑在基板上或上方的端子排上，端子以气密方式延伸穿过盖。 信号或控制端子也可以布置在顺应地支撑在基板上或上方的端子块上，这些端子也以密封的方式延伸穿过盖。 适配器板可以安装在盖上并且包含连接到模块端子的多个端子。 适配器板的端子可以是任何配置以满足用户要求，而不需要改变模块本身的端子配置。 适配器板还可以包含有源和/或无源电路。