公开(公告)号：US20170162723A1

公开(公告)日：2017-06-08

申请号：US14958739

申请日：2015-12-03

申请人： David Fredric Joel Kavulak ,  Gabriel Harley ,  Lewis Abra ,  Matthieu Moors ,  George Nadim Mseis ,  Ludovic Pierre Edmond Hudanski

发明人： David Fredric Joel Kavulak ,  Gabriel Harley ,  Lewis Abra ,  Matthieu Moors ,  George Nadim Mseis ,  Ludovic Pierre Edmond Hudanski

IPC分类号： H01L31/02

CPC分类号： H01L31/02008 ,  H01L31/0508 ,  Y02E10/50

摘要： Approaches for fabricating spot-welded and adhesive bonded interconnects for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. An interconnect structure is electrically connected to the conductive contact structure. The interconnect structure includes a plurality of protrusions in contact with the conductive contact structure. Each of the plurality of protrusions is spot-welded to the conductive contact structure and is surrounded by an adhesive material.