公开(公告)号：US06252765B1

公开(公告)日：2001-06-26

申请号：US09221830

申请日：1998-12-29

申请人： David M. Balzaretti ,  Michael K. Goodman ,  Paul C. Van Note ,  Ron D. Egger ,  Chris H. Hanes

发明人： David M. Balzaretti ,  Michael K. Goodman ,  Paul C. Van Note ,  Ron D. Egger ,  Chris H. Hanes

IPC分类号： G06F116

CPC分类号： G06F1/184 ,  G06F1/187

摘要： A computer peripheral device retention apparatus is disclosed. In one embodiment, the apparatus includes a frame, a control arm slidably coupled to the frame, and first and second locking arms operably coupled to the control arm. A release button is received within the frame and is in operable association with the control arm. A release trigger arm is pivotally attached to the frame and a control arm latch is connected to the control arm at a first end and is releasably coupled to the release trigger arm at a second end. An ejection mechanism is attached to a rear end of the frame. A backplane printed circuit board is also attached to the rear end of the frame and an electrical control system is coupled to the backplane printed circuit board. A solenoid assembly is coupled to the electrical control system and is releasably coupled to the control arm.

摘要翻译： 公开了一种计算机外围设备保持装置。 在一个实施例中，该装置包括框架，可滑动地联接到框架的控制臂以及可操作地联接到控制臂的第一和第二锁定臂。 释放按钮被接收在框架内并且与控制臂可操作地相关联。 释放触发臂枢转地附接到框架，并且控制臂闩锁在第一端处连接到控制臂，并且在第二端处可释放地联接到释放触发臂。 弹出机构附接到框架的后端。 背板印刷电路板也连接到框架的后端，并且电气控制系统耦合到背板印刷电路板。 螺线管组件联接到电气控制系统并且可释放地联接到控制臂。

公开(公告)号：US06324075B1

公开(公告)日：2001-11-27

申请号：US09459442

申请日：1999-12-20

申请人： Edgar J. Unrein ,  Minh T. Le ,  Chris H. Hanes ,  Ron D. Egger

发明人： Edgar J. Unrein ,  Minh T. Le ,  Chris H. Hanes ,  Ron D. Egger

IPC分类号： H05K900

CPC分类号： H05K9/0022 ,  G06F1/182 ,  G06F1/20

摘要： An improved assembly for a computer that includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.

摘要翻译： 一种用于计算机的改进组件，其包括具有第一侧和第二侧的母板。 第一侧具有第一部分和第二部分。 第一部分包含能够产生大量热量和强电场的部件。 组件还包括EMI衰减盖，其封闭母板的第一侧的第一部分，但不包围母板的第一侧的第二部分。

公开(公告)号：US06483704B2

公开(公告)日：2002-11-19

申请号：US09823625

申请日：2001-03-29

申请人： Neal Ulen ,  Chris H. Hanes ,  Ed Unrein

发明人： Neal Ulen ,  Chris H. Hanes ,  Ed Unrein

IPC分类号： H05K720

CPC分类号： H05K7/20509 ,  H05K7/1431

摘要： A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.

摘要翻译： 描述了微处理器散热器保持模块。 该模块包括具有第一侧和第二侧的第一框架。 第一侧与第二侧隔开足以使微处理器安装在框架内的距离。 第一和第二侧每个具有用于接收微处理器散热器的至少一个孔。 该模块还具有与第一框架集成的传热平台。 传热平台包括用于散热由电压调节器产生的基本平坦的金属板。 还描述了一种用于计算机和计算机系统的组件，其包括该微处理器散热器保持模块。