公开(公告)号：US06749489B2

公开(公告)日：2004-06-15

申请号：US10121825

申请日：2002-04-11

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B100

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在精加工循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06817928B2

公开(公告)日：2004-11-16

申请号：US09944798

申请日：2001-08-29

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 第二主体可以具有相对柔软的抛光或抛光表面，以在精加工循环期间从磨料颗粒和其它物质清洗基材。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06358127B1

公开(公告)日：2002-03-19

申请号：US09607507

申请日：2000-06-28

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在精加工循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06394883B1

公开(公告)日：2002-05-28

申请号：US09607515

申请日：2000-06-28

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or, finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在整理循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06368193B1

公开(公告)日：2002-04-09

申请号：US09686361

申请日：2000-10-10

申请人： David W. Carlson ,  Scott A Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment man be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在精加工循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06193588B1

公开(公告)日：2001-02-27

申请号：US09146055

申请日：1998-09-02

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在精加工循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US06210257B1

公开(公告)日：2001-04-03

申请号：US09087420

申请日：1998-05-29

申请人： David W. Carlson

发明人： David W. Carlson

IPC分类号： B24B100

CPC分类号： B24B37/24 ,  B24B37/20 ,  B24B37/245 ,  B24B37/26 ,  B24D3/28 ,  B24D18/009

摘要： A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body. The cutting element can be moved radially inwardly as the body rotates to continuously peel a seamless web of pad material having a desired thickness from the cylindrical pad body. The web of pad material accordingly may be used on a web-format planarizing machine for planarizing microelectronic substrate assemblies.

摘要翻译： 用于微电子基板组件的机械和/或化学机械平面化的网格式抛光垫，以及用于制造和使用这种网格格式垫的方法。 在本发明的一个方面，用于平坦化微电子衬底的网状抛光垫是通过沿着至少基本上平行于主体的纵向中心线的切割线切割衬垫材料的圆柱体并且在径向深度 从身体的外表面向内。 例如，可以通过围绕纵向中心线旋转圆柱体并沿着切割线将切割元件压靠在旋转的圆柱体上来从主体切片。 切割元件可以是具有定位在切割线处的锋利边缘的刀，以及沿着圆柱体的切线延伸的面。 当主体旋转时，切割元件可以径向向内移动，以从圆柱形衬垫主体连续地剥离具有期望厚度的衬垫材料的无缝网。 因此，衬垫材料的网可以用于网格式平面化机器上，用于平坦化微电子衬底组件。

公开(公告)号：US4237245A

公开(公告)日：1980-12-02

申请号：US68308

申请日：1979-08-20

申请人： Adel F. Halasa ,  David W. Carlson ,  James E. Hall

发明人： Adel F. Halasa ,  David W. Carlson ,  James E. Hall

IPC分类号： C08F8/00 ,  C08C19/02 ,  C08F8/04

CPC分类号： C08F8/04

摘要： The composition described herein is a hydrogenated polymer derived from a butadiene diblock copolymer having 85-100%, preferably 95-100% 1,2-structure in one block and the other block comprising essentially 1,4-butadiene. The 1,2-block comprises at least 10%, preferably at least 25%, of the total weight of the diblock copolymer. The hydrogenated product is an elastomeric material which is oxidation-resistant and stable against ozone. Moreover, since the original polymer may be made by a method which permits control of the molecular weight, the molecular weight of the ultimate hydrogenated product is also controllable. The control of molecular weight and microstructure give highly desirable properties in the ultimate elastomeric product, and also control of tacticity and crystallinity.

摘要翻译： 本文描述的组合物是衍生自在一个嵌段中具有85-100％，优选95-100％的1,2-结构的丁二烯二嵌段共聚物的氢化聚合物，另一个嵌段包含基本上1,4-丁二烯。 1,2-嵌段包含二嵌段共聚物总重量的至少10％，优选至少25％。 氢化产物是抗氧化和对臭氧稳定的弹性材料。 此外，由于原始聚合物可以通过允许控制分子量的方法制备，所以最终氢化产物的分子量也是可控的。 分子量和微结构的控制在最终的弹性体产品中提供非常理想的性能，并且还控制立体规整度和结晶度。

公开(公告)号：US06893337B2

公开(公告)日：2005-05-17

申请号：US10336094

申请日：2003-01-03

申请人： David W. Carlson

发明人： David W. Carlson

IPC分类号： B24B37/20 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D13/14 ,  B24D18/00 ,  B24B7/00

CPC分类号： B24B37/24 ,  B24B37/20 ,  B24B37/245 ,  B24B37/26 ,  B24D3/28 ,  B24D18/009

摘要： A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body. The cutting element can be moved radially inwardly as the body rotates to continuously peel a seamless web of pad material having a desired thickness from the cylindrical pad body. The web of pad material accordingly may be used on a web-format planarizing machine for planarizing microelectronic substrate assemblies.

摘要翻译： 用于微电子基板组件的机械和/或化学机械平面化的网格式抛光垫，以及用于制造和使用这种网格格式垫的方法。 在本发明的一个方面，用于平坦化微电子衬底的网状抛光垫是通过沿着至少基本上平行于主体的纵向中心线的切割线切割衬垫材料的圆柱体并且在径向深度 从身体的外表面向内。 例如，可以通过围绕纵向中心线旋转圆柱体并沿着切割线将切割元件压靠在旋转的圆柱体上来从主体切片。 切割元件可以是具有定位在切割线处的锋利边缘的刀，以及沿着圆柱体的切线延伸的面。 当主体旋转时，切割元件可以径向向内移动，以从圆柱形衬垫主体连续地剥离具有期望厚度的衬垫材料的无缝网。 因此，衬垫材料的网可以用于网格式平面化机器上，用于平坦化微电子衬底组件。

公开(公告)号：US07307021B1

公开(公告)日：2007-12-11

申请号：US09678414

申请日：2000-10-02

申请人： David W. Carlson

发明人： David W. Carlson

IPC分类号： H01L21/461

CPC分类号： H01L21/7684 ,  H01L21/76895

摘要： A layer of required material, such as polysilicon, is planarized by first forming a sacrificial layer of material, such as an oxide, on the layer of required material. The combined layers of required and sacrificial materials are then planarized using chemical-mechanical polishing until the sacrificial material has been substantially, completely removed.

摘要翻译： 通过在所需材料层上首先形成诸如氧化物的材料牺牲层，将所需材料（例如多晶硅）层平坦化。 然后使用化学机械抛光使所需和牺牲材料的组合层平坦化，直到牺牲材料已被基本上完全去除。