公开(公告)号：US11758678B2

公开(公告)日：2023-09-12

申请号：US17445116

申请日：2021-08-16

Applicant: Dell Products L.P.

Inventor： Steven Christensen

IPC: H05K7/14 ,  H05K5/03 ,  G06F1/18

CPC classification number: H05K7/1424 ,  G06F1/183 ,  H05K5/03

Abstract: A computing card support system, including: a cage positioned on a PCB, including: a first support structure; a second support structure; a cover that is removably coupled to the support structures and positioned opposite to the PCB, the cover including a grounding material positioned along an inner surface of the cover, the inner surface of the cover facing the PCB; computing cards that are i) coupled to the PCB at a first end of each respective computing card and ii) positioned within the cage, each of the computing cards including conductive pads positioned at a second end opposite to the first end of the respective computing card, wherein the computing cards extend from the PCB toward the cover such that the grounding material of the cover is in contact with the conductive pads of each of the computing cards to provide electrical grounding of the computing cards.

公开(公告)号：US20230048850A1

公开(公告)日：2023-02-16

申请号：US17445116

申请日：2021-08-16

Applicant: Dell Products L.P.

Inventor： Steven Christensen

IPC: H05K7/14 ,  G06F1/18 ,  H05K5/03

Abstract: A computing card support system, including: a cage positioned on a PCB, including: a first support structure; a second support structure; a cover that is removably coupled to the support structures and positioned opposite to the PCB, the cover including a grounding material positioned along an inner surface of the cover, the inner surface of the cover facing the PCB; computing cards that are i) coupled to the PCB at a first end of each respective computing card and ii) positioned within the cage, each of the computing cards including conductive pads positioned at a second end opposite to the first end of the respective computing card, wherein the computing cards extend from the PCB toward the cover such that the grounding material of the cover is in contact with the conductive pads of each of the computing cards to provide electrical grounding of the computing cards.