公开(公告)号：US20150116944A1

公开(公告)日：2015-04-30

申请号：US14065856

申请日：2013-10-29

Applicant: Delphi Technologies, Inc.

Inventor： ROBERT L. VADAS ,  KURT ERIC GILBERTSON

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H01L23/367 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit board. The heat spreader overlies and extends beyond the outline of the device, and is in thermal contact the top side of the surface mount type package. A contact surface of the heat spreader is spaced apart from a mounting surface of the circuit board by a distance based on a height of the top side above the mounting surface. The solder sphere has a pre-reflow diameter sufficient to couple the contact surface to the mounting surface after the solder sphere is reflowed.

Abstract translation: 一种电气组件，包括电路板，电气设备，散热器和焊球。 电气装置是附接到电路板的表面安装型封装。 散热器覆盖并延伸超出设备的轮廓，并且与表面安装型封装的顶侧热接触。 散热器的接触表面基于安装表面上方的顶侧的高度与电路板的安装表面间隔一定距离。 焊球具有足够的预回流直径，以在焊球回流之后将接触表面耦合到安装表面。