MAGNETIC COMPONENT ASSEMBLY AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250029764A1

    公开(公告)日:2025-01-23

    申请号:US18643852

    申请日:2024-04-23

    Abstract: A magnetic component assembly and a manufacturing method thereof are disclosed. The magnetic component assembly includes a magnetic component and a peripheral structure. The magnetic component includes a magnetic core and a winding. The winding is embedded in the magnetic core, and passes through the top surface or the bottom surface of the magnetic core to form a pin. The peripheral structure is disposed adjacent to a peripheral side of the magnetic core. The magnetic component and the peripheral structure are combined to form a magnetic assembling body. The manufacturing method thereof includes a step of thinning the top surface or the bottom surface of the magnetic assembling body through a thinning process. The manufacturing method thereof includes another step of thinning the top surface or the bottom surface of the magnetic core through a thinning process, or thinning the pin through the thinning process.

    MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220130605A1

    公开(公告)日:2022-04-28

    申请号:US17383496

    申请日:2021-07-23

    Abstract: A magnetic element includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic part and a second magnetic part arranged independently. The winding assembly includes a first winding. The first winding is wound around the first magnetic part. Moreover, at least a portion of a substrate is formed as the first winding. The substrate includes a first accommodation space, a second accommodation space and a first metal structure. Moreover, at least a portion of the first metal structure is formed as at least a portion of the first winding. At least a portion of the first magnetic part and at least a portion of the second magnetic part are disposed within the first accommodation space and the second accommodation space, respectively. The substrate has an integral structure.

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