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公开(公告)号：US20210225753A1
公开(公告)日：2021-07-22
申请号：US17154170
申请日：2021-01-21
发明人： Shouyu Hong , Haibin Xu , Tao Wang , Yan Tong , Weicheng Zhou , Ganyu Zhou , Qingdong Chen , Zhenqing Zhao
IPC分类号： H01L23/498 , H01L25/16 , H01L23/538
摘要： A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.
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公开(公告)号：US12002615B2
公开(公告)日：2024-06-04
申请号：US17024720
申请日：2020-09-18
发明人： Shouyu Hong , Ganyu Zhou , Zhiheng Fu , Yan Tong , Qingdong Chen , Xiaoni Xin , Jinping Zhou , Pengkai Ji , Yiqing Ye
CPC分类号： H01F27/2804 , H01F27/24 , H01F27/324 , H01F41/0206 , H01F41/041 , H01F41/125
摘要： The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.
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公开(公告)号：US11444036B2
公开(公告)日：2022-09-13
申请号：US17155956
申请日：2021-01-22
发明人： Shouyu Hong , Yan Tong , Weicheng Zhou , Dongfang Lian , Haiyang Cao , Haibin Xu , Tao Wang , Yicong Xie
IPC分类号： H05K1/14 , H01L23/538 , H01L23/552 , H01L23/66 , H01L23/522 , H01L23/367 , H01L23/528 , H01L25/18
摘要： A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.
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公开(公告)号：US11342257B2
公开(公告)日：2022-05-24
申请号：US17154170
申请日：2021-01-21
发明人： Shouyu Hong , Haibin Xu , Tao Wang , Yan Tong , Weicheng Zhou , Ganyu Zhou , Qingdong Chen , Zhenqing Zhao
IPC分类号： H05K1/02 , H01L23/498 , H01L23/538 , H01L25/16 , H01L23/14
摘要： A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.
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公开(公告)号：US20220130605A1
公开(公告)日：2022-04-28
申请号：US17383496
申请日：2021-07-23
发明人： Shouyu Hong , Qingdong Chen , Zhiheng Fu , Ganyu Zhou , Yan Tong , Wen Han , Jinping Zhou , Pengkai Ji , Yiqing Ye
摘要： A magnetic element includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic part and a second magnetic part arranged independently. The winding assembly includes a first winding. The first winding is wound around the first magnetic part. Moreover, at least a portion of a substrate is formed as the first winding. The substrate includes a first accommodation space, a second accommodation space and a first metal structure. Moreover, at least a portion of the first metal structure is formed as at least a portion of the first winding. At least a portion of the first magnetic part and at least a portion of the second magnetic part are disposed within the first accommodation space and the second accommodation space, respectively. The substrate has an integral structure.
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公开(公告)号：US20210175184A1
公开(公告)日：2021-06-10
申请号：US17155956
申请日：2021-01-22
发明人： Shouyu Hong , Yan Tong , Weicheng Zhou , Dongfang Lian , Haiyang Cao , Haibin Xu , Tao Wang , Yicong Xie
IPC分类号： H01L23/552 , H01L23/66 , H01L23/522 , H01L23/528 , H01L25/18 , H01L23/367
摘要： A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.
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