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公开(公告)号：US08535448B2
公开(公告)日：2013-09-17
申请号：US13180163
申请日：2011-07-11
申请人： Dennis L. Holtermann , Tin-Tack Peter Cheung , Christopher D. Blessing , Lawrence E. Huff , Joseph Bergmeister, III , Robert L. Hise , Geoffrey E. Scanlon , David W. Dockter
发明人： Dennis L. Holtermann , Tin-Tack Peter Cheung , Christopher D. Blessing , Lawrence E. Huff , Joseph Bergmeister, III , Robert L. Hise , Geoffrey E. Scanlon , David W. Dockter
摘要： A method of removing a metal protective layer from a surface of a reactor component comprising treating the metal protective layer with one or more chemical removal agents to remove at least a portion of the metal protective layer from the reactor component. A method of removing a metal protective layer from a surface of a reactor component comprising treating the metal protective layer to remove the metal protective layer from the reactor component, and determining a thickness of the reactor component following treatment.
摘要翻译： 从反应器组件的表面去除金属保护层的方法，包括用一种或多种化学去除剂处理金属保护层以从反应器组分中去除金属保护层的至少一部分。 从反应器组件的表面除去金属保护层的方法，包括处理金属保护层以从反应器组分除去金属保护层，以及确定处理后反应器部件的厚度。
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公开(公告)号：US08119203B2
公开(公告)日：2012-02-21
申请号：US11420904
申请日：2006-05-30
CPC分类号： C10G35/04 , C10G75/00 , C23C4/18 , C23C26/00 , C23C28/021 , C23C28/023
摘要： A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.
摘要翻译： 一种通过将至少一种金属层施加到衬底上以在衬底上形成施加的金属层并随后在亚大气压下固化所施加的金属层以形成金属保护层来处理衬底的方法。 一种通过将至少一种金属层施加到反应器系统的未组装组分的衬底上来处理衬底的方法，以在未组装的组件的衬底上形成施加的金属层，并将所施加的金属层固化在所述衬底上 未组装的组分形成金属保护层。 一种通过将至少一种金属层施加到基板上以形成施加的金属层来处理基板的方法，在第一温度和压力下固化所施加的金属层一段时间，并且将施加的金属层固化在 第二温度和压力持续第二时间段，其中所述固化形成金属保护层。
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公开(公告)号：US07544335B2
公开(公告)日：2009-06-09
申请号：US11136874
申请日：2005-05-25
CPC分类号： B01J8/0214 , B01J8/008 , B01J8/0085 , B01J2208/0053 , B01J2208/00884 , B01J2208/025 , B01J2219/0004
摘要： A radial flow reactor comprising a floating top cover plate assembly. A method of operating a radial flow reactor comprising floating a top cover plate assembly within the reactor.
摘要翻译： 一种包括浮动顶盖板组件的径向流动反应器。 一种操作径向流动反应器的方法，包括在反应器内浮置顶盖板组件。
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