公开(公告)号：US20220402030A1

公开(公告)日：2022-12-22

申请号：US17811673

申请日：2022-07-11

申请人： Destiny Copper Inc.

发明人： Ian David Brindle ,  Molina Audrey Lorraine Sheepwash

IPC分类号： B22F9/20 ,  C22B15/00 ,  C22B5/00 ,  C22B3/08

摘要： Processes for producing copper granules on a surface of a reducing metal. The process can include contacting the reducing metal with an aqueous solution comprising a copper(II) salt and a halide. The molar ratio of the halide to the copper(II) in the copper (II) salt can be at least about 3:1. The granular copper can be produced on a surface of the reducing metal, and is optionally removed from the surface of the reducing metal by shaking, washing, and/or brushing, and/or optionally with stirring and/or circulating of the aqeuous solution.