公开(公告)号：US5395256A

公开(公告)日：1995-03-07

申请号：US150428

申请日：1993-11-10

申请人： Dieter Niessen ,  Heiner Politze ,  Michael Buschmann ,  Georg Pollmann ,  Mario Pussin ,  Michael Pastors

发明人： Dieter Niessen ,  Heiner Politze ,  Michael Buschmann ,  Georg Pollmann ,  Mario Pussin ,  Michael Pastors

IPC分类号： H01R12/57 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/32 ,  H05K1/00 ,  H05K3/34

CPC分类号： H01R12/57 ,  H05K3/222 ,  H05K2201/1031 ,  Y02P70/611 ,  Y10T29/49144

摘要： A contact element suitable for SMD printed circuit boards is made of a flexible blank of sheet metal of approximate C-shaped cross-sectional configuration, with dimensions of a DIL package for SMD integrated circuits. The contact element is provided with bent terminals which are soldered onto respective bonding pads upon the circuit board while the top surface of the contact element is provided for contacting by a resilient external countercontact.

摘要翻译： 适用于SMD印刷电路板的接触元件由具有大致C形横截面构造的金属板的柔性坯料制成，尺寸为用于SMD集成电路的DIL封装。 接触元件设置有弯曲端子，其被焊接到电路板上的相应接合焊盘上，而接触元件的顶表面被设置用于通过弹性外部反接触接触。