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公开(公告)号:US11267236B2
公开(公告)日:2022-03-08
申请号:US15924133
申请日:2018-03-16
Applicant: DIVERGENT TECHNOLOGIES, INC.
Inventor: Calvin Ray MacLean
Abstract: One aspect is an apparatus including a first node including a first bonding surface and a second node including a second bonding surface. The apparatus includes a feature configured to accept an adhesive and an adhesive channel coupled to the feature configured to accept the adhesive. The apparatus includes a shear joint coupling the first node and the second node, the shear joint configured to receive the adhesive in an adhesive region formed by the first bonding surface and the second bonding surface, the adhesive for coupling the first bonding surface to the second bonding surface through the feature configured to accept the adhesive.
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公开(公告)号:US12059867B2
公开(公告)日:2024-08-13
申请号:US17665445
申请日:2022-02-04
Applicant: Divergent Technologies, Inc.
Inventor: Calvin Ray MacLean
IPC: B32B15/01 , B22F10/28 , B22F12/00 , B22F12/49 , B22F12/52 , B32B7/12 , B32B37/12 , B33Y10/00 , B33Y40/00
CPC classification number: B32B15/01 , B32B7/12 , B32B37/1284 , B33Y40/00 , B22F10/28 , B22F12/22 , B22F12/49 , B22F12/52 , B33Y10/00
Abstract: One aspect is an apparatus including a first node including a first bonding surface and a second node including a second bonding surface. The apparatus includes a feature configured to accept an adhesive and an adhesive channel coupled to the feature configured to accept the adhesive. The apparatus includes a shear joint coupling the first node and the second node, the shear joint configured to receive the adhesive in an adhesive region formed by the first bonding surface and the second bonding surface, the adhesive for coupling the first bonding surface to the second bonding surface through the feature configured to accept the adhesive.
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公开(公告)号:US20190283387A1
公开(公告)日:2019-09-19
申请号:US15924133
申请日:2018-03-16
Applicant: DIVERGENT TECHNOLOGIES, INC.
Inventor: Calvin Ray MacLean
Abstract: One aspect is an apparatus including a first node including a first bonding surface and a second node including a second bonding surface. The apparatus includes a feature configured to accept an adhesive and an adhesive channel coupled to the feature configured to accept the adhesive. The apparatus includes a shear joint coupling the first node and the second node, the shear joint configured to receive the adhesive in an adhesive region formed by the first bonding surface and the second bonding surface, the adhesive for coupling the first bonding surface to the second bonding surface through the feature configured to accept the adhesive.
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