MODULAR POLYMERIC EMI/RFI SEAL
    1.
    发明申请
    MODULAR POLYMERIC EMI/RFI SEAL 审中-公开
    模块化POLYMERIC EMI / RFI密封

    公开(公告)号:US20110079962A1

    公开(公告)日:2011-04-07

    申请号:US12897398

    申请日:2010-10-04

    IPC分类号: F16J15/16 F16J15/02 B29C37/00

    CPC分类号: F16J15/3212 F16J15/3236

    摘要: A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 104 Ohm/sq, or any combination thereof.

    摘要翻译: 密封件包括包括环形空腔的密封体和环形空腔内的环形弹簧。 密封体,密封体包括具有热塑性材料和填料的复合材料。 复合材料可以具有至少约0.5GPa的杨氏模量,不大于约200欧姆 - 厘米的体积电阻率,至少约20%的伸长率,不大于约104欧姆/平方厘米的表面电阻率, 或其任何组合。