公开(公告)号：US20060087012A1

公开(公告)日：2006-04-27

申请号：US10970237

申请日：2004-10-21

申请人： Dong Zhong ,  David Figneroa ,  Yuan-Liang Li

发明人： Dong Zhong ,  David Figneroa ,  Yuan-Liang Li

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/34 ,  H01L23/06

CPC分类号： H01L23/50 ,  H01L23/5386 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/167 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to some embodiments, a system includes an integrated circuit package to support an integrated circuit die. The integrated circuit package may include a plurality of conductive contacts, and an element having a plurality of resistive portions, each of the plurality of resistive portions being coupled to a respective one of the plurality of conductive contacts. The integrated circuit package may further include a decoupling capacitor having a plurality of capacitor pads, each of the plurality of capacitor pads being coupled to a respective one of the plurality of resistive portions.

摘要翻译： 根据一些实施例，系统包括用于支撑集成电路管芯的集成电路封装。 集成电路封装可以包括多个导电触点，以及具有多个电阻部分的元件，多个电阻部分中的每一个耦合到多个导电触点中的相应一个。 集成电路封装还可以包括具有多个电容器焊盘的去耦电容器，所述多个电容器焊盘中的每一个耦合到所述多个电阻部分中的相应一个。