摘要:
Apparatus for imaging a surface, including an acousto-optic (AO) system. The AO system includes an AO element having a radiation input surface and a radiation output surface. The element is configured to receive radio-frequency (RF) pulses and a radiation input at the radiation input surface and to generate traveling beams from the radiation output surface. The AO system also includes an inhomogeneous polarization generator, positioned relative to the AO element so that the AO system outputs traveling inhomogeneously polarized beams. The apparatus includes objective optics which are configured to focus the inhomogeneously polarized beams onto the surface so as to form respective traveling spots thereon; collection optics, which are configured to collect scattered radiation from the traveling spots and to focus the scattered radiation to form respective image spots; and a detector which is arranged to receive the respective image spots and to generate a signal in response thereto.
摘要:
Apparatus for imaging a surface, including an acousto-optic (AO) system. The AO system includes an AO element having a radiation input surface and a radiation output surface. The element is configured to receive radio-frequency (RF) pulses and a radiation input at the radiation input surface and to generate traveling beams from the radiation output surface. The AO system also includes an inhomogeneous polarization generator, positioned relative to the AO element so that the AO system outputs traveling inhomogeneously polarized beams. The apparatus includes objective optics which are configured to focus the inhomogeneously polarized beams onto the surface so as to form respective traveling spots thereon; collection optics, which are configured to collect scattered radiation from the traveling spots and to focus the scattered radiation to form respective image spots; and a detector which is arranged to receive the respective image spots and to generate a signal in response thereto.
摘要:
A fixture for simultaneously clamping a number of optical fiber ferrules or fiber stubs for polishing. The fixture includes a plate assembly with an upper surface, a lower surface and a number of ferrule-receiving bores disposed across the upper surface and extending from the upper surface to the lower surface, each ferrule-receiving bore for receiving a ferrule. The fixture further includes a number of ferrule gripper arrangements, each associated with one of the ferrule-receiving bores, each of the ferrule gripper arrangements being selectively deployable between a released state for insertion of a ferrule into the ferrule-receiving bore and a gripping state in which the gripper arrangement clamps a ferrule within the ferrule-receiving bore. The fixture also includes a locking mechanism associated with at least a group of the number of ferrule gripper arrangements and configured to deploy the group of ferrule gripper arrangements substantially simultaneously from the released state to the gripping state so as to clamp substantially simultaneously a number of optical fiber ferrules located within a corresponding group of the ferrule-receiving bores.
摘要:
Disclosed is a method of severing a fiber length projecting out of the end face of a plurality of ferrules. The ferrules are mounted in a polishing fixture. Image processing establishes the fiber cleaving plane. Relative movement between the laser beam and the ferrule severs the fiber protruding out of the ferrule end-face. Excess epoxy that may be present on the ferrule end-face is removed concurrently with the fiber severing process. The method includes cleaning and inspection of ferrules.
摘要:
A precision polishing system able to polish samples to an accuracy within the submicron range is disclosed. The novel polishing system has applications in the semiconductor field for use in polishing silicon wafers during testing and quality control inspections. In the examination of failed wafers during the semiconductor manufacturing process, it is desirable to examine a cross section of the wafer at the point of failure. The polishing system of the present invention enables very accurate polishing of the wafer down to the submicron accuracy range. The sample is held is place by a gripper assembly which is attached to a polishing arm slideably connected to a fixed rail. The polishing arm is raised and lowered to polish the sample using a polishing wheel covered with a suitable abrasive. A video microscope attached to an object lens and a video camera provide images that are processed to control the polishing operation. The video microscope is mounted on a precision X-Y table to facilitate focusing and defect location of the sample in addition to forming part of the closed loop control of the polishing process. Two closed loop feedback control methods are utilized by the invention to achieve high polishing accuracies. The first utilizes electromechanical means to perform rough polishing of the sample. The second method utilizes digital image processing techniques to accurately control the movement of a polishing arm which holds the sample as it is polished.