公开(公告)号：US20040155380A1

公开(公告)日：2004-08-12

申请号：US10723096

申请日：2003-11-26

Applicant: Dow Global Technologies Inc.

Inventor： John E. Kendall ,  Gary C. Rex ,  Robert L. Seats ,  David H. Bank ,  Robert P. Dion

IPC: B29C071/00

CPC classification number: B29C70/46 ,  B29C67/246 ,  B29K2067/00

Abstract: There is disclosed a molding compound. The molding compound preferably includes a macrocyclic oligoester that reacts with itself, a secondary compound or another macrocyclic oligoester during molding of the molding compound. Exemplary secondary compounds include a cyclic ester, a dihydroxyl-functionalized polymer or the like.

Abstract translation: 公开了一种模塑料。 成型化合物优选包含在模塑料的成型期间与其自身反应的大环低聚酯，次要化合物或其它大环低聚酯。 示例性的二次化合物包括环酯，二羟基官能化聚合物等。