公开(公告)号：US20250075072A1

公开(公告)日：2025-03-06

申请号：US18558115

申请日：2022-05-04

Applicant: Dow Global Technologies LLC

Inventor： Praveen Agarwal ,  Rogelio Gamboa ,  Mohammad Arif Hossain ,  An Kaga

IPC: C08L75/04 ,  C08G18/10 ,  C08G18/20 ,  C08G18/32 ,  C08G18/80 ,  C08K3/08 ,  C08K5/00

Abstract: Thermally conductive compositions include a blocked isocyanate prepolymer composition containing an isocyanate prepolymer blocked with one or more of alkylphenol or alkenylphenol; and an amine composition containing: one or more polyetheramines, and one or more plasticizers selected from esters of glycol ethers; and a thermally conductive filler present at a percent by weight of the thermally conductive composition (wt %) in a range of 60 wt % to 98 wt %; wherein the thermally conductive composition cures at a temperature in the range of 18° C. to 35° C. when the blocked isocyanate prepolymer composition and the amine composition are mixed.