CURABLE SILICONE COMPOSITION, ENCAPSULANT AND OPTICAL SEMICONDUCTOR DEVICE

    公开(公告)号:US20220064380A1

    公开(公告)日:2022-03-03

    申请号:US17387573

    申请日:2021-07-28

    IPC分类号: C08G77/12 C08G77/08 H01L33/56

    摘要: A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
    The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c≤0.9, 0≤d 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.