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公开(公告)号:US20220064380A1
公开(公告)日:2022-03-03
申请号:US17387573
申请日:2021-07-28
发明人: Akito Hayashi , Sawako Horie
摘要: A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c≤0.9, 0≤d 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.-
公开(公告)号:US12110412B2
公开(公告)日:2024-10-08
申请号:US17387573
申请日:2021-07-28
发明人: Akito Hayashi , Sawako Horie
IPC分类号: C09D183/04 , C08G77/08 , C08G77/12 , H01L23/29 , H01L33/56
CPC分类号: C09D183/04 , C08G77/08 , C08G77/12 , H01L23/296 , H01L33/56 , C08L2203/206 , C08L2205/025 , C09D183/04 , C08L83/00 , C08L83/00 , C09D183/04 , C08L83/00 , C08K5/5435
摘要: A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I):
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.-
公开(公告)号:US20220017746A1
公开(公告)日:2022-01-20
申请号:US17361788
申请日:2021-06-29
申请人: DuPont Toray Specialty Materials Kabushiki Kaisha , Rohm and Haas Electronic Materials Korea Ltd.
发明人: Sawako Horie , Shunya Takeuchi , Akihiko Kobayashi , Misoon Jung , Hyunji Kang
IPC分类号: C08L83/04
摘要: A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) unit, (B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO4/2) unit, (C) a catalyst for hydrosilylation reaction, and (D) a curing reaction inhibitor. The curable silicone composition exhibits practically effective curability even at low temperatures, has a low shape deformation and shrinkage rate during curing, can be cured in a short period of time, and can form a transparent and high-hardness cured product.
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