公开(公告)号：US12132073B2

公开(公告)日：2024-10-29

申请号：US18465733

申请日：2023-09-12

Applicant: EPISTAR CORPORATION

Inventor： Min Hsun Hsieh ,  Hsin-Mao Liu

IPC: H01L31/12 ,  G09G3/32 ,  H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L27/15 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L33/385 ,  H01L33/44 ,  H01L2224/24 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light-emitting module including a first optoelectronic unit having a first electrode pad and a second electrode pad, a second optoelectronic unit having a third electrode pad and a fourth electrode pad, a first supporting structure enclosing the first optoelectronic unit and the second optoelectronic unit, a first pin overlapping and confronted with both of the first electrode pad and the third electrode pad, a second pin overlapping the second electrode pad and the first supporting structure, and a third pin overlapping the fourth electrode pad and physically separated from the second pin.

公开(公告)号：US20240355955A1

公开(公告)日：2024-10-24

申请号：US18637314

申请日：2024-04-16

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Takuma YAJIMA ,  Yusaku FUJII

IPC: H01L33/00 ,  H01L33/56

CPC classification number: H01L33/0012 ,  H01L33/0066 ,  H01L33/56 ,  H01L2933/005

Abstract: A light emitting element includes an element main body and a sapphire substrate 90. The element main body has an AlGaAs-based semiconductor layer 50, an n-type current diffusion layer 60, and a cap layer 70 of an InGa-based semiconductor that does not contains As as a component in a lamination direction. The amorphous layer 80 is interposed between the element main body and the sapphire substrate 90, and contains constituent elements of the cap layer 70 and the sapphire substrate 90 as components.

公开(公告)号：US12125951B2

公开(公告)日：2024-10-22

申请号：US17530543

申请日：2021-11-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Erik Johansson ,  Robert Fitzmorris ,  Kevin Wiese ,  James Wyckoff

IPC: H01L33/50 ,  H01L25/16 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/504 ,  H01L25/167 ,  H01L33/005 ,  H01L33/54 ,  H01L33/56 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A structure comprising a nanoparticle converting electromagnetic radiation of a first wavelength into electromagnetic radiation of a second wavelength range, an interlayer at least partially surrounding the nanoparticle, and an encapsulation at least partially surrounding the interlayer is specified, wherein the interlayer comprises a plurality of first amphiphilic ligands and a plurality of second amphiphilic ligands and the first ligands and the second ligands are intercalated.
Furthermore, an agglomerate comprising a plurality of structures, an optoelectronic device as well as methods for producing a structure and an agglomerate are disclosed.

公开(公告)号：US20240347680A1

公开(公告)日：2024-10-17

申请号：US18579474

申请日：2022-07-21

Applicant: ams-OSRAM International GmbH

Inventor： Michael Zitzlsperger ,  Hansjörg Schöll

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L33/005 ,  H01L33/483 ,  H01L33/56 ,  H01L2933/005

Abstract: In an embodiment an arrangement includes an optoelectronic component having a radiation passage surface and a housing top surface, which surrounds the radiation passage surface in lateral directions at least in places and a cover covering the radiation passage surface and the housing top surface at least in places, wherein the cover is configured to be partially removed such that the radiation passage surface is at least partially exposed and the housing top surface remains covered at least in places by a remainder of the cover.

公开(公告)号：US12119434B2

公开(公告)日：2024-10-15

申请号：US18358657

申请日：2023-07-25

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.

公开(公告)号：US12110412B2

公开(公告)日：2024-10-08

申请号：US17387573

申请日：2021-07-28

Applicant: DuPont Toray Specialty Materials Kabushiki Kaisha

Inventor： Akito Hayashi ,  Sawako Horie

IPC: C09D183/04 ,  C08G77/08 ,  C08G77/12 ,  H01L23/29 ,  H01L33/56

CPC classification number: C09D183/04 ,  C08G77/08 ,  C08G77/12 ,  H01L23/296 ,  H01L33/56 ,  C08L2203/206 ,  C08L2205/025 ,  C09D183/04 ,  C08L83/00 ,  C08L83/00 ,  C09D183/04 ,  C08L83/00 ,  C08K5/5435

Abstract: A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I):



(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.

公开(公告)号：US20240312973A1

公开(公告)日：2024-09-19

申请号：US18670209

申请日：2024-05-21

Applicant: Quanzhou San’an Semiconductor Technology Co., Ltd.

Inventor： Junpeng SHI ,  Chen-Ke HSU ,  Chang-Chin YU ,  Yanqiu LIAO ,  Zhenduan LIN ,  Zhaowu HUANG ,  Senpeng HUANG

IPC: H01L25/16 ,  H01L27/15 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L27/156 ,  H01L33/56 ,  H01L33/62

Abstract: A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.

公开(公告)号：US12094864B2

公开(公告)日：2024-09-17

申请号：US18315758

申请日：2023-05-11

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L27/02 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20240297162A1

公开(公告)日：2024-09-05

申请号：US18663754

申请日：2024-05-14

Applicant: Zhongshan Mulinsen Electronics Co., Ltd.

Inventor： Baoqing PI ,  Xuezhao HE ,  Lei ZHU

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0091

Abstract: A new type of LED light, related to a technical field of LED, including a cup body. The cup body includes a first light-emitting assembly, a second light-emitting assembly and a third light-emitting assembly. The first light-emitting assembly is used to emit green light, the second light-emitting assembly is used to emit blue light, and the third light-emitting assembly is used to emit blue light. A first phosphor layer is provided on the second light-emitting assembly or the third light-emitting assembly, so that the blue light emitted by the second light-emitting assembly or the third light-emitting assembly is transformed into red light after passing through the first phosphor layer. The present disclosure emits red light through a combination of blue light and a phosphor layer, replacing traditional red lights, improving the performance of the new type of LED light and reducing costs.

公开(公告)号：US12080835B2

公开(公告)日：2024-09-03

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.