公开(公告)号：US09681726B2

公开(公告)日：2017-06-20

申请号：US14323864

申请日：2014-07-03

Applicant: Dyson Technology Limited

Inventor： Patrick Joseph William Moloney ,  Paul Anthony Andrew Grant ,  Anthony Thomas Gosnay ,  Peter David Gammack ,  Edward Sebert Maurice Shelton ,  Stephen Benjamin Courtney

IPC: A45D20/10

CPC classification number: A45D20/10

Abstract: Disclosed is a hair care appliance comprising a body, a fluid flow path extending through the body from a fluid inlet to a fluid outlet and a PCB extending about the fluid flow path. The PCB may be annular. The PCB may be isolated from the fluid flow path. The PCB may comprise a first layer and a second layer. The first layer may extend substantially continuously about the fluid flow path and the second layer may extend partially about the fluid flow path. The second layer may be adjacent the first layer and may be downstream of the first layer. The body may comprise a duct and the fluid flow path extends through the duct. The PCB may extend about the duct. The body may comprise a primary fluid flow path extending about the duct which may be in fluid communication with the PCB.

公开(公告)号：US09808066B2

公开(公告)日：2017-11-07

申请号：US14903047

申请日：2014-06-13

Applicant: Dyson Technology Limited

Inventor： Patrick Joseph William Moloney ,  Anthony Thomas Gosnay ,  Nicholas Stuart Harrod ,  Robert Lawrence Tweedie ,  Christopher Daniel Wilkinson ,  Stephen Benjamin Courtney

IPC: A45D20/10 ,  A45D20/48 ,  A45D2/00 ,  A45D20/12 ,  A45D20/50

CPC classification number: A45D20/10 ,  A45D2/00 ,  A45D20/122 ,  A45D20/48 ,  A45D20/50

Abstract: A hair care appliance including, a body, a heater, a PCB and a primary fluid flow path extending from a primary fluid inlet into the appliance to a primary fluid outlet out of the body wherein the PCB and heater are in fluid communication with the primary fluid flow path and the PCB is upstream of the heater. A fan unit may be provided and the fan unit is upstream of the heater and may be upstream or downstream of the PCB. A thermal barrier may be provided between the PCB and the heater. The thermal barrier may be in thermal communication with the PCB and functions as a heat sink for the PCB.