公开(公告)号：US10178803B2

公开(公告)日：2019-01-08

申请号：US15068220

申请日：2016-03-11

Applicant: EATON CORPORATION

Inventor： Abhinav Dixit ,  Atul Singhal ,  David Glenn Woolard ,  Tarun Malik

IPC: F28D15/02 ,  H05K7/20 ,  F28D1/053 ,  H01L29/861

Abstract: An apparatus includes at least one evaporator having a surface configured for mounting of a power electronic device thereon, a condenser fluidically coupled to the at least one evaporator by at least two coolant conduits that electrically insulate the at least one evaporator from the condenser, and a dielectric coolant contained in a thermosyphon loop comprising the at least one evaporator, the condenser and the at least two coolant conduits. The at least one evaporator may include at least two evaporators fluidically coupled by at least one coupler that electrically insulates the at least two evaporators from one another. The at least one evaporator may be housed within an enclosure, and the condenser may be positioned within the enclosure or outside of the enclosure.