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公开(公告)号:US10828486B2
公开(公告)日:2020-11-10
申请号:US15765987
申请日:2016-10-28
IPC分类号: C22C1/00 , A61N1/04 , C22C28/00 , C22C5/02 , H05K1/02 , A61N1/05 , A61B5/0408 , H01B1/02 , H05K1/09 , A61B5/0478
摘要: A method for manufacturing an electrical conductor includes: depositing a solid metal conductive layer or film on a substrate 30; depositing a liquid metal on the solid layer; and allowing the liquid metal and the solid layer 40 to alloy by diffusion of the liquid metal into the solid layer or film so as to form a solid conductive layer or film of the alloy; as well as allowing the liquid metal to further infiltrate the alloy so as to form percolating paths and/or droplets of the liquid metal in the the solid conductive layer or film, thus forming a biphasic conductive layer.