公开(公告)号：US20130237035A1

公开(公告)日：2013-09-12

申请号：US13774244

申请日：2013-02-22

Applicant: ELECTRO SCIENTIFIC, INDUSTRIES, INC.

Inventor： Yasu OSAKO ,  Daragh FINN

IPC: H01L21/78 ,  B23K26/00

CPC classification number: H01L21/78 ,  B23K26/0006 ,  B23K26/0626 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract translation: 用于将电子衬底分离成骰子的改进方法使用激光器首先在衬底中形成切口，然后通过改变激光器参数来倒角切口的边缘。 倒角通过减少残余损伤并消除由初始激光切割引起的碎片而增加冲模强度，而不需要额外的工艺步骤，附加设备或消耗品。