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公开(公告)号:US20220266382A1
公开(公告)日:2022-08-25
申请号:US17185259
申请日:2021-02-25
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Inventor: Joel Schrauben , Jan Kleinert
IPC: B23K26/0622 , B23K26/082
Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
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公开(公告)号:US10957615B2
公开(公告)日:2021-03-23
申请号:US16067693
申请日:2017-03-31
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Inventor: Joel Schrauben , Jan Kleinert
IPC: H01L21/48 , H01L23/15 , H01L23/498
Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
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公开(公告)号:US20190019736A1
公开(公告)日:2019-01-17
申请号:US16067693
申请日:2017-03-31
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Inventor: Joel Schrauben , Jan Kleinert
IPC: H01L23/15 , H01L21/48 , H01L23/498
Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
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