公开(公告)号：US20220266382A1

公开(公告)日：2022-08-25

申请号：US17185259

申请日：2021-02-25

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Joel Schrauben ,  Jan Kleinert

IPC: B23K26/0622 ,  B23K26/082

Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.

公开(公告)号：US10957615B2

公开(公告)日：2021-03-23

申请号：US16067693

申请日：2017-03-31

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Joel Schrauben ,  Jan Kleinert

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.

公开(公告)号：US20190019736A1

公开(公告)日：2019-01-17

申请号：US16067693

申请日：2017-03-31

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Joel Schrauben ,  Jan Kleinert

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/498

Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.