公开(公告)号：US3814895A

公开(公告)日：1974-06-04

申请号：US21223471

申请日：1971-12-27

Applicant: ELECTROGLAS INC

Inventor： FREDRIKSEN T

IPC: B23K26/08 ,  B23K27/00

CPC classification number: B23K26/0853

Abstract: A laser scribe system is disclosed for aligning a wafer on which circuits are deposited, and for controlling the motion of a chuck, supporting the wafer, so that kerfs are cut in the wafer between all the circuits. The chuck is movable along X and Y axes in a XY plane by two indexable stepping motors, with a laser providing a beam in a direction perpendicular to the XY plane. The system is operable in an Align mode in which the chuck is movable back and forth in the X axis and the chuck is rotatable about an axis perpendicular to the XY plane until streets, representing wafer space between circuits, are aligned in the X axis. The system automatically sequences through several scribing phases during which the chuck is moved automatically in the X and Y axes at optimum speed to cut kerfs in all the streets of the wafer.

Abstract translation: 公开了用于对准其上沉积有电路的晶片的激光划片系统，并且用于控制支撑晶片的卡盘的运动，使得在所有电路之间的晶片中切割切口。 卡盘可以通过两个可转位步进电机在XY平面中沿X和Y轴移动，激光器在垂直于XY平面的方向上提供光束。 系统可以在对准模式中操作，其中卡盘可以在X轴上来回移动，并且卡盘可以绕垂直于XY平面的轴线旋转，直到代表电路之间的晶片间隔的街道在X轴上对准。 该系统通过多个划线阶段自动序列，在此阶段卡盘以最佳速度在X和Y轴上自动移动，以切割晶片所有街道上的切口。