公开(公告)号：US20230317679A1

公开(公告)日：2023-10-05

申请号：US18003364

申请日：2021-06-29

Applicant: ELTA SYSTEMS LTD.

Inventor： Yaniv Maydar ,  Gil Peshes ,  Michael Kedem

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L23/5385 ,  H01L23/3128 ,  H01L23/5384 ,  H01L25/50 ,  H01L24/96 ,  H01L2224/96

Abstract: An integrated circuit assembly and a method for fabricating the same are disclosed. The integrated circuit assembly includes: a base structure including an interposer board and a plurality of interfacing dies electrically coupled to said interposer board; a cap structure including an intermediating board and a panel of active elements having a plurality of active elements electrically coupled to the intermediating board. The cap structure is attached to the base structure such that the active elements are electrically coupled to the interfacing dies. Also disclosed are a tile including a backend circuit board configured to attach to the plurality of integrated circuits and provide electrical connectivity thereto the plurality of integrated circuits, and a method of fabricating the same, as well as an array of the plurality of such tile in cascade connection.