公开(公告)号：US20220022312A1

公开(公告)日：2022-01-20

申请号：US17364728

申请日：2021-06-30

Applicant: ELTEK AS

Inventor： CHRISTINE AMER ,  ERIC MYHRE ,  Håkon HAFNOR ,  JAN TORE BRASTAD ,  KJETIL HAGEN

IPC: H05K1/02 ,  H05K7/20

Abstract: The present disclosure relates to an electric circuit system. The system includes a housing, a printed circuit board mounted within the housing, an electric component conductively mounted to the printed circuit board, and a cooling system for transferring heat away from of the electric component. The printed circuit board is compartmentalizing the inside of the housing into a first compartment and a second compartment, and the electric component is situated in the first compartment. The cooling system includes at least one first heat transferring element located adjacent to the electric component. The at least one first heat transferring element is secured to the housing surrounding the second compartment capable of forming a heat flowing path defined to transfer heat from the electric component to the housing via the at least one first heat transferring element.