METHOD FOR MANUFACTURING COMMON MODE OR DIFFERENTIAL MODE INDUCTOR AND COMMON MODE OR DIFFERENTIAL MODE INDUCTOR

    公开(公告)号:US20220028604A1

    公开(公告)日:2022-01-27

    申请号:US17362866

    申请日:2021-06-29

    申请人: ELTEK AS

    摘要: The present disclosure provides a common or differential mode inductor for connection to a printed circuit board. The inductor includes a core, a first coil including a first insulated wire wound with a number of turns around the core, and a supporting device for supporting the core and the first coil. The supporting device includes a base element having a PCB contacting surface, and a first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the PCB contacting surface, wherein the distal end is defining an alignment plane. The core has a first end plane facing the alignment plane and a second end plane, wherein the first end plane is facing the alignment plane. The second end plane is facing the base element.

    OUTDOOR POWER SUPPLY SYSTEM INCLUDING A PASSIVE COOLING SYSTEM

    公开(公告)号:US20210400847A1

    公开(公告)日:2021-12-23

    申请号:US17353419

    申请日:2021-06-21

    申请人: ELTEK AS

    IPC分类号: H05K7/20 H02B1/30

    摘要: The present disclosure relates to a power supply system (1) including a main unit (10) including a protective main housing (11) and a distribution circuit (20) disposed in the protective main housing (11); a first module unit (30a) including a first protective module housing (31a) and a first electric module (40a) disposed in the first protective module housing (31a). The system also includes a passive cooling system (70) for cooling of the main unit (10) and the first module unit (30a). A first protective connection system (CS1) and a second protective connection system (CS2) is also a part of the system, wherein the first protective connection system (CS1) is configured to provide a releasable electrical and mechanical connection between the main unit (10) and the first module unit (30a). The passive cooling system (70) includes cooling fins (71) disposed on an outer surface of the first protective module housing (31a).

    ELECTRIC CIRCUIT SYSTEM AND ASSEMBLING METHOD THEREOF

    公开(公告)号:US20220022312A1

    公开(公告)日:2022-01-20

    申请号:US17364728

    申请日:2021-06-30

    申请人: ELTEK AS

    IPC分类号: H05K1/02 H05K7/20

    摘要: The present disclosure relates to an electric circuit system. The system includes a housing, a printed circuit board mounted within the housing, an electric component conductively mounted to the printed circuit board, and a cooling system for transferring heat away from of the electric component. The printed circuit board is compartmentalizing the inside of the housing into a first compartment and a second compartment, and the electric component is situated in the first compartment. The cooling system includes at least one first heat transferring element located adjacent to the electric component. The at least one first heat transferring element is secured to the housing surrounding the second compartment capable of forming a heat flowing path defined to transfer heat from the electric component to the housing via the at least one first heat transferring element.