公开(公告)号：US20030026991A1

公开(公告)日：2003-02-06

申请号：US10219215

申请日：2002-08-13

Applicant: EMC TECHNOLOGY, INC.

Inventor： Rajendra Shah ,  Joseph B. Mazzochette ,  Martin A. Helfand

IPC: B32B009/00

CPC classification number: H01C17/0652 ,  H01C1/084 ,  H01C7/048 ,  H01L23/3732 ,  H01L27/013 ,  H01L27/016 ,  H01L2924/0002 ,  Y10T428/265 ,  Y10T428/30 ,  H01L2924/00

Abstract: A substrate having a diamond or diamond-like carbon coating of at least one micron thickness on an underlayer of an insulating material such as AlN. Such a substrate is advantageously used as a mounting for passive electrical components such as microwave and radio-frequency (rf) resistors, capacitors, attenuators, terminators and loads.

Abstract translation: 在绝缘材料如AlN的底层上具有至少一微米厚度的金刚石或类金刚石碳涂层的基底。 这种衬底有利地用作无源电气部件如微波和射频（rf）电阻器，电容器，衰减器，终端器和负载的安装。