公开(公告)号：US20140026404A1

公开(公告)日：2014-01-30

申请号：US14043836

申请日：2013-10-01

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： EZEKIEL KRUGLICK ,  MARK MELONI

IPC: B23P19/04

CPC classification number: B23P19/04 ,  F16B17/00 ,  H05B6/105 ,  Y10T29/49815 ,  Y10T29/49822 ,  Y10T29/53 ,  Y10T428/24521

Abstract: Technologies are generally described for providing inductively removable assembly bonding. Inductive elements may be placed strategically at bonding locations between two or more coupled components. At disassembly time, the elements may be heated through Radio Frequency (RF) energy causing the bonds to break and components to separate. For example, inductive elements placed near plastic stake bonds between dissimilar materials in an electronic device may be employed to separate the dissimilar materials during a recycling process. According to some examples, the elements may also be heated through a directly applied electric current via a network of connections designed into the assembly.

Abstract translation: 通常描述技术来提供电感可拆卸的组装接合。 电感元件可以策略地放置在两个或更多个耦合部件之间的接合位置处。 在拆卸时，元件可能会通过射频（RF）能量加热，导致键断裂，并使元件分离。 例如，可以使用放置在电子设备中的不同材料之间的塑料桩附近的感应元件来在再循环过程中分离不同的材料。 根据一些示例，元件还可以经由设计到组件中的连接网络通过直接施加的电流加热。