Low-melting copolyamide and their use as hot-melt adhesives
    1.
    发明申请
    Low-melting copolyamide and their use as hot-melt adhesives 有权
    低熔点共聚酰胺及其作为热熔胶的用途

    公开(公告)号:US20020022670A1

    公开(公告)日:2002-02-21

    申请号:US09852218

    申请日:2001-05-09

    申请人: EMS-Chemie Ag

    IPC分类号: C09K003/00

    摘要: Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic null,null-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl- 1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture. The copolyamides according to the invention are used for the production of mono- and multifilaments, fibers, films and nets.

    摘要翻译: 由以下组分的缩聚产物组成的共聚酰胺:己内酰胺10至45mol%,月桂内酰胺30至55mol%,至少2个二羧酸20至50mol%的以下化合物,脂族α,ω-二羧酸 包括6至14个C原子,对苯二甲酸,间苯二甲酸和2,6-萘二甲酸,其中芳族二羧酸的含量低于10摩尔%,相对于上述组分的总量 ,其加入量为100摩尔%,二胺混合物的量等于与二羧酸等摩尔量的二胺混合物,其选自下列物质:六亚甲基二胺,哌嗪和/或2-甲基-1,5- 二氨基戊烷,其中六亚甲基二胺的摩尔含量相对于二胺混合物为75至95摩尔%。 根据本发明的共聚酰胺用于生产单丝和复丝,纤维,薄膜和网。