摘要:
A pipe joining material for connecting pipes and fittings and a method of making a pipe joining material are provided. The pipe joining material may include a thermoplastic material such as polyvinyl chloride (PVC) and/or chlorinated polyvinyl chloride (CPVC) and a bonding agent for the thermoplastic material.
摘要:
Provided are low-melt polyimides and poly(amic acids) (PAAs) for use as adhesives, and methods of using the materials for attaching two substrates. The methods typically form an adhesive bond that is hermetically sealed to both substrates. Additionally, the method typically forms a cross-linked bonding material that is flexible.
摘要:
A multilayer laminate comprising in order, a polymeric film layer capable of withstanding a temperature of at least 200 C for at least 10 min, an adhesive layer having an areal weight of from 2 to 40 gsm capable of activation at a temperature of from 75 to 200 degrees C. and an inorganic refractory layer wherein the refractory layer comprises platelets in an amount at least 85% by weight with a dry areal weight of 15 to 50 gsm and has a residual moisture content of no greater than 10 percent by weight.
摘要:
A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.
摘要:
A method of joining two objects includes applying an adhesive composition between and in contact with a first object and a second object, and allowing the adhesive composition to harden to form an adhesive bond between the first and second objects, wherein the adhesive composition consists essentially of an optional stabilizer and a reversible polymer material that can reversibly transition between a liquid state and a solid state by reversible cycloaddition reactions, wherein upon cooling, the reversible polymer material transitions from a liquid state to a solid state by reversible cycloaddition reactions within a time period of less than about 2 minutes.
摘要:
The present invention relates to a conductive adhesive for screen printing containing metal colloid particles (A) containing metal nanoparticles (A1) and a protective colloid (A2) containing an organic compound having a carboxyl group and a polymer dispersant having a carboxyl group, a viscosity modifier (B) having an amide bond and/or a urea bond, and a dispersion solvent (C).
摘要:
The present invention relates to compounds having the general Formula I: which absorb UV radiations and protect biological materials as well as non-biological materials from damaging exposure to UV radiations. The present invention also relates to formulations and compositions comprising such compounds for use in absorbing UV radiations and in protecting biological materials as well as non-biological materials against UV radiations.
摘要:
A multilayer laminate comprising in order, a polymeric film layer capable of withstanding a temperature of at least 200 C for at least 10 min, an adhesive layer having an areal weight of from 2 to 40 gsm capable of activation at a temperature of from 75 to 200 degrees C. and an inorganic refractory layer wherein the refractory layer comprises platelets in an amount at least 85% by weight with a dry areal weight of 15 to 50 gsm and has a residual moisture content of no greater than 10 percent by weight.