公开(公告)号：US20220282034A1

公开(公告)日：2022-09-08

申请号：US17637195

申请日：2020-08-07

Applicant: ENEOS Corporation

Inventor： Toshiaki EGASHIRA

IPC: C08G63/60 ,  C09K19/38 ,  C09K19/54

Abstract: Disclosed are liquid crystal polymer particles capable of reducing dielectric loss tangent while suppressing surface roughness of the resin film, when added to a resin film. The liquid crystal polymer particles have a melting point of 270° C. or higher, wherein cumulative distribution 50% diametre D50 in the particle size distribution is 20 μm or less, and cumulative distribution 90% diametre D90 is 2.5 times or less of D50.

公开(公告)号：US20240002591A1

公开(公告)日：2024-01-04

申请号：US18253629

申请日：2021-11-22

Applicant: ENEOS Corporation

Inventor： Toshiaki EGASHIRA ,  Hiroaki MURAKAMI

IPC: C08G63/60 ,  C08L67/03 ,  C08J3/12 ,  C08J5/18 ,  C09K19/38

CPC classification number: C08G63/605 ,  C08L67/03 ,  C08J3/12 ,  C08J5/18 ,  C09K19/38

Abstract: The invention provides a liquid crystal polymer particle which, when added to a resin film, can allow the resin film to be reduced in dielectric tangent with increases in surface roughness and linear coefficient of expansion of the resin film being suppressed. The liquid crystal polymer particle according to the invention, in which 80% by mass or more of the entire particle is flat, and a longer size, a shorter size, and a thickness defined below of a flat liquid crystal polymer particle satisfies the following conditions (A) and (B): (A) an elongation as the ratio of the longer size and the shorter size is 1.2 or more and 5.0 or less, (B) a degree of flatness as the ratio of the shorter size and the thickness is 1.2 or more.