公开(公告)号：US3769382A

公开(公告)日：1973-10-30

申请号：US3769382D

申请日：1972-05-15

申请人： ENGELHARD MIN & CHEM

发明人： KUO C ,  ANGEL H

IPC分类号： H01C7/00 ,  C03C3/072 ,  C03C8/18 ,  C03C17/04 ,  C04B35/00 ,  C04B41/88 ,  H01C17/065

CPC分类号： H01C17/06526

摘要： A COMPOSITION FOR USE IN THICK FILM RESISTIVE ELEMENTS HAVING A LOW TEMPERATURE COEFFICIENT OF RESISTANCE IS PREPARED BY CODEPOSITING FROM AN AQUEOUS SOLUTION AT LEAST TWO PRECIOUS METALS ONE OF WHICH IS RUTHENIUM OR IRIDIUM ONTO LEAD-CONTAINING GLASS FRIT, OTHER METAL COMPONENTS MAY ALSO BE DEPOSITED ON THE GLASS FRIT; PREFIRING THE RESULTING GLASS FRIT AT A TEMPERATURE OF AT LEAST ABOUT 600* C., AND PREFERABLY BELOW THE MELTING POINT OF THE PRECIOUS METALS DEPOSITED THEREONF AND COMMINUTING THE PREFIRED GLASS FRIT TO A SIZE SUITABLE TO BE FORMULATED IN A RESISTOR PASTE TO PREPARE THICK FILM RESISTIVES. A PARTICULARLY ADVANTAGEOUS GLASS FRIT FOR APPLICATION IN THICK FILM RESISTIVES HAS DEPOSITED THEREON RUTHENIUM OR IRIDIUM, GOLD OR PLATINUM, AND RHODIUM. PREFERABLY, THE COMPOSITION IS ESSENTIALLY FREE OF SILVER.