摘要:
In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
摘要:
Systems and methods are provided for presenting branding elements with electronic content. In one implementation, a method is provided that includes receiving, from a user device, a request that identifies a segment of electronic content and that contains information specifying a display configuration of the user device. The method further includes selecting first metadata including information defining how at least one branding element is to be presented based on the display configuration of the user device, and selecting second metadata for the requested segment of electronic content, the second metadata including information related to presenting the requested segment of electronic content. Additionally, the method includes instructing the user device to generate a presentation based on the selected first metadata and the selected second metadata, the presentation including the requested segment of electronic content and the at least one branding element.
摘要:
There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
摘要:
An electrostatic discharge protector including two electrodes for forming a discharge gap, and a discharge gap filling-member including a discharge gap filing composition filed in the discharge gap, the discharge gap filling composition contains metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector includes the composition; R—O-[M(OR)2—O—]n—R (1) wherein M is a metal atom, O is an oxygen atom, R is an alkyl group, all or a part of R's may be the same as or different each other, and n is an integer of 1 to 40. Also disclosed is an electronic circuit board including the electrostatic discharge protector and an electronic device.
摘要翻译:一种静电放电保护器,包括用于形成放电间隙的两个电极和包括放电间隙中的放电间隙填充组合物的放电间隙填充构件,放电间隙填充组合物含有金属颗粒(A),其由具有水解的金属颗粒 由下式(1)表示的金属醇盐和粘合剂组分(C)的产物,静电放电保护剂包括组合物; R-O- [M(OR)2-O-] n -R(1)其中M是金属原子,O是氧原子,R是烷基,R的全部或部分可以与 或彼此不同,n为1〜40的整数。还公开了包括静电放电保护器和电子设备的电子电路板。
摘要:
A thermistor includes a first electrically conductive member, a second electrically conductive member and a polymer material layer laminated therebetween. The polymer material layer exhibits positive temperature coefficient (PTC) behavior, and includes at least one crystalline polymer and at least one electrically conductive filler distributed in the crystalline polymer. The conductive filler has a resistivity less than 500 μΩ-cm and includes 72-96% by weight of the polymer material layer. The thermistor has a device effective area, and the value of the hold current at 60° C. divided by the device effective area is around 0.16-0.8 A/mm2. The ratio of the hold current of the thermistor at 60° C. to the hold current at 25° C. of the thermistor is 40-95%.
摘要:
A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.
摘要:
Use of a composition comprising finely divided particles of (a) an electrically-conductive material; (b) one or more inorganic binders; and (c) zinc, wherein components (a), (b) and (c) are dispersed in a liquid vehicle, in the manufacture of an electrically-conductive pattern on a substrate for the purpose of increasing the resistivity of said electrically-conductive pattern.
摘要:
Use of a composition comprising finely divided particles of (a) an electrically-conductive material; (b) one or more inorganic binders; and (c) zinc, wherein components (a), (b) and (c) are dispersed in a liquid vehicle, in the manufacture of an electrically-conductive pattern on a substrate for the purpose of increasing the resistivity of said electrically-conductive pattern.
摘要:
A composition of voltage switchable dielectric (VSD) material that utilizes semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material.
摘要:
For production of a high-temperature sensor, in which a platinum resistance film is applied on a metal-oxide substrate, in particular sapphire or a ceramic plate, and a ceramic intermediate layer is laid on the resistance film, a self-supporting cover, in particular a ceramic or glass-ceramic cover, is bonded on the ceramic intermediate layer or a glass ceramic is mounted on the intermediate layer over its entire surface. Advantageously, the glass ceramic is electrically conductive or an ion conductor above 750° C. and is laid on up to the cathode of the resistance film up to beyond the intermediate layer. In particular, the cover is bonded with a metal-doped glass ceramic, which is laid on the cathode of the resistance film up to beyond the intermediate layer. Preferably, the electrically insulating intermediate layer is coated with a glass ceramic or a glass ceramic doped with metal, which coating has a resistance of at most one megaohm per square at 850° C. or above.