THERMALLY INSULATING SPACER PROFILE
    1.
    发明申请

    公开(公告)号:US20170089120A1

    公开(公告)日:2017-03-30

    申请号:US15372994

    申请日:2016-12-08

    申请人: ENSINGER GMBH

    IPC分类号: E06B3/263 E04B2/96 E06B3/64

    摘要: A spacer profile comprises: a basic body extending in a longitudinal direction of the profile with an outer contour which is substantially rectangular or trapezoid-shaped in a cross-section perpendicular to the longitudinal direction; the body comprising first and second transverse walls connected by a single side wall element and held at a pre-set spacing h; the side wall element ending with a first end at a first edge region of the first transverse wall and with a second end at a first edge region of the second transverse wall; the side wall element forming a path for thermal conduction from the first transverse wall to the second transverse wall, the path length approximately 1.1 or more times the spacing h; and comprising an anchoring protrusion held on the first transverse wall and extends from the body in a direction opposite to the second transverse wall.