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公开(公告)号:US20180306646A1
公开(公告)日:2018-10-25
申请号:US15770155
申请日:2016-10-18
申请人: EPCOS AG
发明人: Jan IHLE , Anke WEIDENFELDER
IPC分类号: G01K7/22
CPC分类号: G01K7/22 , B28B3/02 , B28B11/243 , G01K7/16 , H01C7/043 , H01C17/281
摘要: A sensor arrangement and a method for producing a sensor arrangement are disclosed. In an embodiment, the sensor arrangement for a temperature measurement includes a sensor element with at least one electrode and at least one contacting element, wherein the contacting element is arranged and configured for wireless contacting of the sensor element.
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2.
公开(公告)号:US20170219440A1
公开(公告)日:2017-08-03
申请号:US15329219
申请日:2015-07-14
申请人: EPCOS AG
发明人: Heinz STRALLHOFER , Gerald KLOIBER , Thomas STENDEL , Jan IHLE
IPC分类号: G01K7/22
摘要: A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.
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公开(公告)号:US20150377734A1
公开(公告)日:2015-12-31
申请号:US14767044
申请日:2014-01-20
申请人: EPCOS AG
发明人: Jan IHLE , Andreas PESCHKA , Bert HUNDERTMARK , Benjamin BOHL , Bernhard OSTRICK
CPC分类号: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
摘要: A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
摘要翻译: 规定具有压力传感器芯片的压力传感器系统,其安装在具有被引导到压力传感器芯片的压力进料的陶瓷壳体的安装座上。 壳体是三维形状并且整体地形成,并且由具有热膨胀系数的陶瓷材料形成,所述陶瓷材料的热膨胀系数在压力传感器芯片的热膨胀系数大于或等于30℃的温度范围内偏离小于30% 等于-40℃且小于或等于150℃
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