公开(公告)号：US10094792B2

公开(公告)日：2018-10-09

申请号：US14775127

申请日：2013-12-24

Applicant: EVERFINE PHOTO-E-INFO CO., LTD.

Inventor： Jiangen Pan ,  Cong Chen ,  Yan Huang

IPC: G01K17/00 ,  G01N25/18 ,  G01N25/20 ,  G06F11/30

Abstract: The present invention provides a method for analysis of thermal structures, not only to reduce analysis errors caused by temperature measurement errors, but also to get the thermal resistance of contact interfaces and the internal resistance distribution of heat conduction components of a DUT, by establishing a heat conduction model of the DUT, solving and analyzing a mathematic heat conduction model on the basis of temperature data of a heat source and thermal model parameters, thus realizing the accurate quantitative analysis of thermal resistance structure of the DUT, comprehensively evaluating the thermal contact conditions inside the whole DUT, and providing an important basis for improving the heat dissipation design of LED and other devices. The analysis method features in simplicity, high accuracy, high speed, wide application range, etc.