公开(公告)号：US12228591B2

公开(公告)日：2025-02-18

申请号：US17780444

申请日：2020-11-25

Applicant: EATON INTELLIGENT POWER LIMITED

Inventor： Armen Baronian ,  Yash Veer Singh ,  Piranavan Suntharalingam ,  Mikhail Goykhman ,  Galen Chui

IPC: G01R1/20 ,  G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R19/00 ,  G01R19/32 ,  H02M7/00

Abstract: A current sensing system includes a pre-calibrated busbar, a voltage sensor, a temperature sensor and a controller. The pre-calibrated busbar has a known resistance, a known variation in resistance with respect to temperature and known dimensions. The voltage sensor detects a difference in voltage between a first location and a second location on the pre-calibrated busbar. The temperature sensor detects an ambient temperature of the pre-calibrated busbar. The controller determines a resistance of the busbar between the first location and the second location based on the known resistance, known variation in resistance, known dimensions and the ambient temperature. The controller additionally determines a current flowing through the pre-calibrated busbar based on the difference in voltage and the determined resistance. The current sensing system has numerous applications including using the determined current to control an operating condition of a solid state circuit breaker or a solid state power controller.

公开(公告)号：US12231033B2

公开(公告)日：2025-02-18

申请号：US17909215

申请日：2021-03-05

Applicant: EATON INTELLIGENT POWER LIMITED

Inventor： Yash Veer Singh ,  Armen Baronian ,  Piranavan Suntharalingam ,  Mikhail Goykhman ,  Galen Chui

IPC: H02M1/08 ,  H02M1/00 ,  H02M1/36 ,  H02M1/44

Abstract: A gate drive circuit of a wide band gap power device (IGBT) includes a buffer, a di/dt sensing network, a turn-on circuit portion and turn-off circuit portion. The buffer, responsive to turn-on, supplies a first current via the first current path to the gate of the IGBT, and responsive to turn-off ceases the supply of the first current. The di/dt sensing network receives a feedback control signal representative of a voltage measurement across a parasitic inductance that exists between a Kelvin emitter and a power emitter of the IGBT. The turn-on circuit portion, responsive to turn-on and a parasitic inductance of zero volts, supplies a second current via a second current path to the gate of the IGBT. The turn-off circuit portion, responsive to turn-off and a parasitic inductance of zero volts, discharges a gate capacitance of the IGBT through both the first current path and a third current path.

公开(公告)号：US20250112450A1

公开(公告)日：2025-04-03

申请号：US18868622

申请日：2023-05-26

Applicant: Eaton Intelligent Power Limited

Inventor： Piranavan Suntharalingam ,  Armen Baronian ,  Andrew Rockhill

IPC: H02H3/087

Abstract: A solid-state circuit breaker for a DC system includes a switching module having a first terminal detachably connectable to a DC power source and a second terminal detachably connectable to a load. The switching module has a predetermined plurality of solid-state switches connected in parallel between the first and second terminals. An energy absorbing module has a first terminal detachably connectable to the DC power source and a second terminal detachably connectable to the load. The switching module includes a predetermined plurality of solid-state Transient Voltage Supressors (TVS) connected in parallel between the first and second terminals.

公开(公告)号：US12267980B2

公开(公告)日：2025-04-01

申请号：US17787194

申请日：2020-12-15

Applicant: EATON INTELLIGENT POWER LIMITED

Inventor： Armen Baronian ,  Yash Veer Singh ,  Piranavan Suntharalingam ,  Mikhail Goykhman ,  Galen Chui

IPC: H05K7/20 ,  H05K7/14

Abstract: A power converter system includes a printed circuit board having a first connector for receiving low voltage control signals and a second connector for receiving input voltages from one or more power generators and transmitting output voltages to a power distribution unit. Power devices are mounted onto the printed circuit board to manage the input voltages and to generate the output voltages. An enclosure is mounted around the printed circuit board and power devices. The power devices engage interior surfaces of the enclosure forming a conductive heat path between the power devices, the interior surfaces, and exterior surfaces of the enclosure. The heat path conductively transfers heat from the power devices to the exterior surfaces.