SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号:US20160305022A1

    公开(公告)日:2016-10-20

    申请号:US15095330

    申请日:2016-04-11

    申请人: Ebara Corporation

    IPC分类号: C23C16/458 C23C16/52

    摘要: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.

    摘要翻译: 公开了一种基板处理装置,其能够高精度地将基板(例如晶片)的中心与基板台的中心轴对准。 基板处理装置包括:偏心检测器,被配置为当从定心台的中心轴保持在定心台上时获得基板的中心的偏心量和偏心方向; 以及对准器,其被配置为执行移动和旋转定心台的定心操作,直到定心台上的基板的中心位于处理台的中心轴线上。 对准器被配置为基于定心台的中心轴线相对于中心轴线的初始相对位置来计算定心台架将被移动的距离和定心台架将要旋转的角度 的加工阶段,偏心量和偏心方向。